Abstract: The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.

Abstract: The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.

Abstract: This application discloses an electronic device including a cooling structure and a plurality of electrical components. The cooling structure is made from a thermally conductive material, and has an exterior surface, an interior surface and a hollow portion defined by the interior surface. The exterior surface is configured to radiate away heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The electrical components are contained within the hollow portion. Heat generated by the electrical components during operation of the electronic device is carried away by the cooling structure. In some implementations, the exterior surface includes a base form and a plurality of surface features that project away from the base form, and the surface features are physically configured to form a helical structure that wraps around the cooling structure and increases rate of thermal radiation from the exterior surface.

Abstract: This application discloses an electronic device including a cooling structure and a plurality of electrical components. The cooling structure is made from a thermally conductive material, and has an exterior surface, an interior surface and a hollow portion defined by the interior surface. The exterior surface is configured to radiate away heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The electrical components are contained within the hollow portion. Heat generated by the electrical components during operation of the electronic device is carried away by the cooling structure. In some implementations, the exterior surface includes a base form and a plurality of surface features that project away from the base form, and the surface features are physically configured to form a helical structure that wraps around the cooling structure and increases rate of thermal radiation from the exterior surface.