Patents by Inventor Andreas Armin Fenner

Andreas Armin Fenner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS
    Publication number: 20140374145
    Abstract: Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.
    Type: Application
    Filed: June 25, 2014
    Publication date: December 25, 2014
    Inventors: Paul F. Gerrish, Geoffrey D. Batchelder, Andreas Armin Fenner, Lary R. Larson, Anna J. Malin, Michael F. Mattes, Tyler Mueller, David A. Ruben, Larry E. Tyler
  • Hermeticity testing
    Patent number: 7902851
    Abstract: Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: March 8, 2011
    Assignee: Medtronic, Inc.
    Inventors: Andreas Armin Fenner, Geoffrey Batchelder, Paul F. Gerrish, Lary R. Larson, Anna J. Malin, Trevor D. Marrott, Tyler Mueller, David A. Ruben
  • HERMETICITY TESTING
    Publication number: 20100315110
    Abstract: Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
    Type: Application
    Filed: September 29, 2009
    Publication date: December 16, 2010
    Applicant: Medtronic, Inc.
    Inventors: Andreas Armin Fenner, Geoffrey Batchelder, Paul F. Gerrish, Lary R. Larson, Anna J. Malin, Trevor D. Marrott, Tyler Mueller, David A. Ruben
  • HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS
    Publication number: 20100314149
    Abstract: Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.
    Type: Application
    Filed: September 29, 2009
    Publication date: December 16, 2010
    Applicant: Medtronic, Inc.
    Inventors: Paul F. Gerrish, Geoffrey Batchelder, Andreas Armin Fenner, Lary R. Larson, Anna J. Malin, Michael F. Mattes, Tyler Mueller, David A. Ruben, Larry E. Tyler
  • Interconnection of active and passive components in substrate
    Publication number: 20030080401
    Abstract: Interconnection of active and passive components in a substrate built using wafer fabrication techniques increase routing density by using a silicon substrate and using silicon processing technologies to embed interconnects and components into the substrate. Implantable medical devices including surge protection, output transistors, and other high power components are interconnected using the substrates.
    Type: Application
    Filed: October 17, 2002
    Publication date: May 1, 2003
    Inventors: Andreas Armin Fenner, Lary R. Larson
  • Interconnection of active and passive components in substrate
    Publication number: 20020074633
    Abstract: Interconnection of active and passive components in a substrate built using wafer fabrication techniques increase routing density by using a silicon substrate and using silicon processing technologies to embed interconnects and components into the substrate. Implantable medical devices including surge protection, output transistors, and other high power components are interconnected using the substrates.
    Type: Application
    Filed: December 18, 2000
    Publication date: June 20, 2002
    Inventors: Lary R. Larson, Andreas Armin Fenner