Patents by Inventor Andreas Kucher
Andreas Kucher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11444011Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.Type: GrantFiled: November 12, 2020Date of Patent: September 13, 2022Assignee: Infineon Technologies AGInventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
-
Publication number: 20210066172Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.Type: ApplicationFiled: November 12, 2020Publication date: March 4, 2021Inventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
-
Publication number: 20210031047Abstract: An implantable medical device for the defibrillation of a patient's heart includes an energy storage device for providing a voltage, and at least one electrode for generating an electrical current pulse by way of the voltage. The energy storage device includes at least two capacitors for providing the voltage. The medical device is configured to prompt a further electrical current pulse by way of a reduced voltage from a parallel connection of the at least two capacitors in the event of the short circuit. A method for controlling an implantable medical device is also provided.Type: ApplicationFiled: July 31, 2020Publication date: February 4, 2021Inventors: THOMAS DOERR, ANDREAS KUCHER
-
Patent number: 10872848Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.Type: GrantFiled: October 25, 2018Date of Patent: December 22, 2020Assignee: Infineon Technologies AGInventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
-
Publication number: 20200135626Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.Type: ApplicationFiled: October 25, 2018Publication date: April 30, 2020Inventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
-
Patent number: 10396018Abstract: A semiconductor package includes a plurality of half bridge assemblies each including a metal lead, a first power transistor die attached to a first side of the metal lead, and a second power transistor die disposed under the first power transistor die and attached to a second side of the metal lead opposite the first side. Each metal lead has a notch which exposes one or more bond pads at a side of the second power transistor die attached to the metal lead. The semiconductor package also includes a controller die configured to control the power transistor dies. Each power transistor die, each metal lead and the controller die are embedded in a mold compound. Bond wire connections are provided between the controller die and the one or more bond pads at the side of each second power transistor die exposed by the notch in the corresponding metal lead.Type: GrantFiled: November 27, 2017Date of Patent: August 27, 2019Assignee: Infineon Technologies AGInventors: Chau Fatt Chiang, Chan Lam Cha, Wei Han Koo, Andreas Kucher, Theng Chao Long
-
Publication number: 20190164873Abstract: A semiconductor package includes a plurality of half bridge assemblies each including a metal lead, a first power transistor die attached to a first side of the metal lead, and a second power transistor die disposed under the first power transistor die and attached to a second side of the metal lead opposite the first side. Each metal lead has a notch which exposes one or more bond pads at a side of the second power transistor die attached to the metal lead. The semiconductor package also includes a controller die configured to control the power transistor dies. Each power transistor die, each metal lead and the controller die are embedded in a mold compound. Bond wire connections are provided between the controller die and the one or more bond pads at the side of each second power transistor die exposed by the notch in the corresponding metal lead.Type: ApplicationFiled: November 27, 2017Publication date: May 30, 2019Inventors: Chau Fatt Chiang, Chan Lam Cha, Wei Han Koo, Andreas Kucher, Theng Chao Long
-
Patent number: 9364681Abstract: An implantable heart therapy device connected to at least one right-ventricular electrode and one left-ventricular electrode that sense and stimulate the heart. The at least one right-ventricular and left-ventricular electrodes are each connected to a tachycardia identification unit, wherein the identification unit identifies ventricular tachycardias, and simultaneously evaluates the heart rate at the right-ventricular and at the left-ventricular electrodes. The implantable heart therapy device includes a right-ventricular stimulation unit that delivers antitachycardia stimulation to the right-ventricular electrode, a left-ventricular stimulation unit that delivers antitachycardia stimulation to the left-ventricular electrode, and a therapy control unit that assigns the stimulation location for the antitachycardia stimulation to the slower ventricle side if a dissimilar tachycardia is present.Type: GrantFiled: July 3, 2014Date of Patent: June 14, 2016Assignee: BIOTRONIK SE & CO. KGInventors: Thomas Doerr, Andreas Kucher
-
Patent number: 9314643Abstract: A heart therapy device having a right-ventricular electrode and a left-ventricular electrode connected to a tachycardia identification unit. The tachycardia identification unit identifies ventricular tachycardia and simultaneously evaluates the heart rate at the right-ventricular and left-ventricular electrodes. The ventricular electrodes each include an electrode line having a corresponding sensing electrode pole that senses electric potential courses in the myocardium of the respective ventricle. The heart therapy device includes a dislocation identification unit that detects a possible dislocation of one of the ventricular electrodes, simultaneously evaluates the heart rate at both ventricular electrodes, and signals a right-ventricular or left-ventricular dislocation when a sudden rise in heart rate is sensed at the right-ventricular or left-ventricular electrode, without detecting a considerable change in rhythm at the respective electrode.Type: GrantFiled: July 3, 2014Date of Patent: April 19, 2016Assignee: BIOTRONIK SE & CO. KGInventors: Andreas Kucher, Thomas Doerr
-
Publication number: 20150025592Abstract: An implantable heart therapy device connected to at least one right-ventricular electrode and one left-ventricular electrode that sense and stimulate the heart. The at least one right-ventricular and left-ventricular electrodes are each connected to a tachycardia identification unit, wherein the identification unit identifies ventricular tachycardias, and simultaneously evaluates the heart rate at the right-ventricular and at the left-ventricular electrodes. The implantable heart therapy device includes a right-ventricular stimulation unit that delivers antitachycardia stimulation to the right-ventricular electrode, a left-ventricular stimulation unit that delivers antitachycardia stimulation to the left-ventricular electrode, and a therapy control unit that assigns the stimulation location for the antitachycardia stimulation to the slower ventricle side if a dissimilar tachycardia is present.Type: ApplicationFiled: July 3, 2014Publication date: January 22, 2015Applicant: BIOTRONIK SE & CO. KGInventors: Thomas DOERR, Andreas Kucher
-
Publication number: 20150025593Abstract: A heart therapy device having a right-ventricular electrode and a left-ventricular electrode connected to a tachycardia identification unit. The tachycardia identification unit identifies ventricular tachycardia and simultaneously evaluates the heart rate at the right-ventricular and left-ventricular electrodes. The ventricular electrodes each include an electrode line having a corresponding sensing electrode pole that senses electric potential courses in the myocardium of the respective ventricle. The heart therapy device includes a dislocation identification unit that detects a possible dislocation of one of the ventricular electrodes, simultaneously evaluates the heart rate at both ventricular electrodes, and signals a right-ventricular or left-ventricular dislocation when a sudden rise in heart rate is sensed at the right-ventricular or left-ventricular electrode, without detecting a considerable change in rhythm at the respective electrode.Type: ApplicationFiled: July 3, 2014Publication date: January 22, 2015Applicant: BIOTRONIK SE & CO. KGInventors: Andreas Kucher, Thomas Doerr
-
Patent number: 8239019Abstract: An implantable electrostimulation device having at least three input channels, (each forming a sensing channel), which are each connected to at least one electrode or to one terminal for an electrode, using which at least three different electrical potentials accompanying an excitation of cardiac tissue (myocardium) in a heart may be detected. Uses a signal processing unit which is connected to the input channels and is implemented to analyze the time curve of the potentials detected via the three sensing channels as three input signals in chronological relation to a periodically repeating trigger signal, which triggers a time window, and which is also implemented to detect predefined signal features for each of the three input signals within the time window triggered by the trigger signal, store them, and compare them to corresponding signal features of preceding time windows or of another input channel within the same time window.Type: GrantFiled: October 10, 2006Date of Patent: August 7, 2012Assignee: Biotronik CRM Patent AGInventors: Thomas Dörr, Andreas Kucher, Jens Philipp, Ingo Weiss
-
Publication number: 20070123940Abstract: An implantable electrostimulation device having at least three input channels, (each forming a sensing channel), which are each connected to at least one electrode or to one terminal for an electrode, using which at least three different electrical potentials accompanying an excitation of cardiac tissue (myocardium) in a heart may be detected. Uses a signal processing unit which is connected to the input channels and is implemented to analyze the time curve of the potentials detected via the three sensing channels as three input signals in chronological relation to a periodically repeating trigger signal, which triggers a time window, and which is also implemented to detect predefined signal features for each of the three input signals within the time window triggered by the trigger signal, store them, and compare them to corresponding signal features of preceding time windows or of another input channel within the same time window.Type: ApplicationFiled: October 10, 2006Publication date: May 31, 2007Inventors: Thomas Dorr, Andreas Kucher, Jens Philipp, Ingo Weiss
-
Patent number: 6512946Abstract: A method of detecting cardiac interval signals in cardiologic devices comprises the following method steps: time-resolved detection of cardiac events which are representative of the cardiac intervals; determination of the respective cardiac interval values between two successive cardiac events; statistical evaluation of a certain number of successive cardiac interval values; and individual comparison of the certain number of cardiac interval values with each other such that individual cardiac interval values which deviate significantly from cardiac interval values that occur there-before and there-after are recognized as faulty measurements and corrected.Type: GrantFiled: June 22, 2000Date of Patent: January 28, 2003Assignee: Biotronik Mess und Therapiegerate GmbH & Co. Ingenieurburo BerlinInventors: Andreas Hahn, Andreas Kucher
-
Patent number: 6480739Abstract: Method for avoiding the detection of a far-field QRS by the atrial detector of a heart pacemaker or ICD while allowing the detection of a true atrial signal to a maximum possible extent; the method comprising generating a Short Atrial Refractory Period (SARP) following an atrial sensed or paced event by means of a SARP timer, blanking of the atrial detector following a ventricular paced event, generating a Post Ventricular Short Atrial Refractory Period (PVSARP) following a ventricular sensed or paced event by means of a PVSARP timer, generating a temporary decrease in the sensivity of an amplifier for the atrial signal for a time period following the elapse of the mentioned PVSARP, and gradually increasing the sensitivity of the amplifier for the atrial signal after said time period.Type: GrantFiled: March 30, 2001Date of Patent: November 12, 2002Assignee: Biotronik Mess - und Therapiegeräte GmbH & Co. Ingenieurbüro BerlinInventors: Indra B. Nigam, Andreas Hahn, Andreas Kucher, Mrigank Shekhar