Abstract: A method for processing a thin glass is provided. The thin glass is subjected to a tensile stress ?app smaller than 1.15 · Min ? ( ? _ a - ? a ? 0.4 · ( 1 - ln ? ( A ref A App ? ? ) ) , ? ? _ e - ? e ? 0.4 · ( 1 - ln ? ( L ref L App ? ? ) ) ) , wherein ?a is a mean value of tensile stress at break for fractures in a surface of samples of the thin glass under bending stress, wherein ?a is a mean value of tensile stress at break for fractures emanating from an edge of the samples, wherein Lref is an edge length and Aref is a surface area of the samples, wherein ?e and ?a denote standard deviations of the mean values ?e and ?a, respectively, and wherein Aapp is a surface area of the thin glass, Lapp is a summated edge length of opposite edges of the thin glass, and ? is a predefined maximum fracture rate within a period of time of at least half a year.

Abstract: A method and a device are provided for detecting defects in coils, such as rollable ultra-thin glass, rollable glass films, rollable laminated ultra-thin glasses or films, rollable solar cells, and rollable organic light emitting diodes (OLEDs).

Abstract: A lightweight composite panel is provided that includes at least one mineral glass or glass-ceramic panel and at least one organic layer. The weight per unit area of the lightweight composite panel is in the range from 0.5 kg/m2 to 5.5 kg/m2, the ratio of the total thickness of the one or more mineral glass or glass-ceramic panels to the total thickness of all of the organic layers is from 1:0.01 to 1:1 and the total thickness of all of the organic layers is less than or equal to 350 ?m. The lightweight composite panel complies with the thermal safety requirements of the air travel authorities and its “Total Heat Release,” measured in accordance with JAR/FAR/CS 25, App. F, Part IV & AITM 2.0006, is less than 65 kW×min/m2 and its flame time after removal of the flame in the “Vertical Bunsen Burner Test”, measured in accordance with FAR/JAR/CS 25, App. F, Part 1 & AITM 2.0002A, is less than 15 s.

Abstract: A method is provided for preparing transparent workpieces for separation. The method includes generating aligned filament formations extending transversely through the workpiece along an intended breaking line using ultra-short laser pulses.

Abstract: A method and an apparatus for detecting cracks in semiconductor substrates, such as silicon wafers and solar cells, are provided. The method and apparatus are based on the detection of light deflected at a crack.

Abstract: The invention relates to a method and an apparatus for detecting cracks in semiconductor substrates, such as silicon wafers and solar cells. The method and apparatus are based on the detection of light deflected at a crack.

Abstract: A method for the thermographic inspection of nonmetallic materials, particularly coated nonmetallic materials, is provided. The method includes heating at least one part of the surface of the nonmetallic material, preferably a part of the surface furnished with a nonmetallic coating, by a short energy pulse, preferably a light pulse, or by periodic input of heat, and recording the temporal and spatial temperature profile at least at a plurality of successive time points.