Abstract: An optoelectronic semiconductor component is disclosed. In an embodiment an optoelectronic semiconductor component includes a front side, a first diode and a second diode arranged downstream of one another in a direction away from the front side and electrically connected in series such that the first diode is located closer to the front side than the second diode and an electrical tunnel contact between the first and the second diodes, wherein the second diode comprises a diode layer of SinGe1-n, where 0?n?1, wherein the first diode comprises a first partial layer of SiGeC, a second partial layer of SiGe and a third partial layer of SiGeC, and wherein the partial layers follow one another directly in the direction away from the front side according to their numbering such that the first and third partial layers are of (SiyGe1-y)1-xCx, whereas 0.05?x?0.5 or 0.25?x?0.75, and whereas 0?y?1, and the second partial layer is of SizGe1-z, whereas 0?z?1.

Abstract: A semiconductor device having a highly doped quantum structure emitter is disclosed. In an embodiment, the semiconductor device includes a quantum structure emitter. The quantum structure emitter includes of a first layer made of an undoped semiconductor material with a large band gap, a second, middle, highly doped layer made of a semiconductor material with a low band gap and a third, undoped layer made of a semiconductor material with a large band gap.

Abstract: A semiconductor device having a highly doped quantum structure emitter is disclosed. In an embodiment, the semiconductor device includes a quantum structure emitter. The quantum structure emitter includes of a first layer made of an undoped semiconductor material with a large band gap, a second, middle, highly doped layer made of a semiconductor material with a low band gap and a third, undoped layer made of a semiconductor material with a large band gap.

Abstract: An optoelectronic semiconductor component is disclosed. In an embodiment an optoelectronic semiconductor component includes a front side, a first diode and a second diode arranged downstream of one another in a direction away from the front side and electrically connected in series such that the first diode is located closer to the front side than the second diode and an electrical tunnel contact between the first and the second diodes, wherein the second diode comprises a diode layer of SinGe1-n, where 0?n?1, wherein the first diode comprises a first partial layer of SiGeC, a second partial layer of SiGe and a third partial layer of SiGeC, and wherein the partial layers follow one another directly in the direction away from the front side according to their numbering such that the first and third partial layers are of (SiyGe1-y)1-xCx, whereas 0.05?x?0.5 or 0.25?x?0.75, and whereas 0?y?1, and the second partial layer is of SizGe1-z, whereas 0?z?1.

Abstract: The invention relates to a novel silicon-based, single-stage solar cell which, instead of converting light in a bulk semiconductor material, generates electrical energy within a very thin quantum structure that is deposited. The layer sequence itself consists of a three-fold hetero structure as an absorber, which is embedded into the space charge region of a pn-junction and is based on quantummechanical effects. Therein, the layer is preferably deposited by a CVD or the like method. High efficiencies of above 30% were initially measured on small samples on silicon.