Abstract: A mold frame for the production of molded pieces, comprising at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame, and comprising at least one heating element for heating at least a part of the mold frame.

Abstract: A mold frame for the production of molded pieces, comprising at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame, and comprising at least one heating element for heating at least a part of the mold frame.

Abstract: A concrete mold including a mold frame with a frame body and at least two rows of teeth formed on the frame body lying opposite one another and in each case facing a mold insert. The mold insert has an insert body and at least two rows of teeth arranged on the insert body lying opposite one another and in each case facing the mold frame. Recesses are in each case formed on the insert body between teeth of its rows of teeth, in which recesses teeth of the rows of teeth of the frame body in each case engage in the assembled state of the mold. Recesses are in each case formed on the frame body between the teeth of its rows of teeth, in which recesses the teeth of the rows of teeth of the insert body in each case engage in the assembled state of the mold.

Abstract: In summary, the invention concerns a mold frame for the production of molded pieces, comprising: at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame.

Abstract: In summary, the invention concerns a mold frame for the production of molded pieces, comprising: at least one mold cavity, the at least one mold cavity being defined by a plurality of mold walls, wherein at least one mold wall of the mold cavity is a mold wall that is displaceably attached to the mold frame.

Abstract: A mold, for producing molded blocks with at least one lateral face which has a texture, comprises a mold lower part and at least one flexible belt, wherein the flexible belt surrounds at least one mold wall of the mold lower part that delimits a mold cavity of the mold lower part in order to act on the material for producing the molded block that is received in the mold cavity, to impress a texture on at least one of the lateral faces of the molded block, wherein the flexible belt is moveable relative to the mold lower part and is mounted in such a way that the flexible belt moves around the mold wall when the molded block is ejected from the mold cavity. The mold comprises an active auxiliary device by means of which a rolling resistance of the flexible belt can be varied.

Abstract: A device is provided for monitoring and controlling a machine having at least two sensors for recording measurement variables, particularly motion variables, and with an electronic control loop for evaluating the recorded measurement variables and correspondingly controlling machine components by means of which the measurement variables can be influenced.

Abstract: An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a stack have identical layouts, while chip select circuits which can be set irreversibly via contact areas are disposed on the chips, which chip select circuits enable an irreversible assignment of the contact areas to the stack intermediate planes.

Abstract: The leadframe interposer is provided with an upset which is formed by shaping in a central region and enlarges the vertical dimension of the interposer there in such a way that, during the assembly of a housing stack of a plurality of semiconductor chips, the upset presses against a topside or underside of a chip housing in such a way that a compensating torque is exerted on the interposer, which prevents a possible strain or deformation when the leads are pressed onto the contact regions of the interposer. The contact regions are laterally offset with respect to one another.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: The leadframe interposer is provided with an upset which is formed by shaping in a central region and enlarges the vertical dimension of the interposer there in such a way that, during the assembly of a housing stack of a plurality of semiconductor chips, the upset presses against a topside or underside of a chip housing in such a way that a compensating torque is exerted on the interposer, which prevents a possible strain or deformation when the leads are pressed onto the contact regions of the interposer. The contact regions are laterally offset with respect to one another.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a stack have identical layouts, while chip select circuits which can be set irreversibly via contact areas are disposed on the chips, which chip select circuits enable an irreversible assignment of the contact areas to the stack intermediate planes.