Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for measuring and controlling local impedances at a substrate support in a plasma processing chamber during processing of a substrate. A substrate support includes a plurality of substrate support pins wherein the radio frequency voltage, current and phase of each of the plurality of substrate support pins are measured and impedances of the support pins are adjusted in real time. Each of the substrate support pins is coupled to an associated adjustable impedance circuit that may be remotely controlled. In one embodiment a variable capacitor is used to adjust the impedance of the impedance circuit coupled to the associated substrate support pin and may be remotely adjusted with a stepper motor.

Abstract: A vaporizer device includes various modular components. The vaporizer device includes a first subassembly. The first subassembly includes a cartridge connector that secures a vaporizer cartridge to the vaporizer device and includes at least two receptacle contacts that electrically communicate with the vaporizer cartridge. The vaporizer device includes a second subassembly. The second subassembly includes a skeleton defining a rigid tray that retains at least a power source. The vaporizer device also includes a third subassembly. The third subassembly includes a plurality of charging contacts that supply power to the power source, and an end cap that encloses an end of the vaporizer device.

Abstract: A package substrate is provided and includes a core board body and a first circuit structure and a second circuit structure disposed on opposite sides of the core board body, where the number of wiring layers of the second circuit structure is different from the number of wiring layers of the first circuit structure, so that the package substrate is asymmetrical. The first circuit structure and the second circuit structure are designed according to the thickness and coefficient of thermal expansion of the first dielectric layer of the first circuit structure and the second dielectric layer of the second circuit structure, so as to prevent the problem of warping from occurring to the package substrate.

Abstract: An electronic package of which the manufacturing method is to dispose an electronic element on a circuit portion, encapsulate the electronic element with an Ajinomoto build-up film (ABF) used as an encapsulating layer, form a wiring layer on the encapsulating layer, and form a conductive via in the encapsulating layer. Therefore, the wiring layer can be well bonded onto the encapsulating layer as the ABF material is used as the encapsulating layer.

Abstract: A method of operating a mobile cleaning robot can include navigating the mobile cleaning robot within an environment. Whether a movement condition is satisfied can be determined and a mopping pad tray can be moved relative to a body of the mobile cleaning robot between a cleaning position and a stored position in response to receipt of a command to move the mopping pad tray when the movement condition is satisfied.

Abstract: A manufacturing method of a package substrate is provided, the manufacturing method includes forming a first circuit layer on a first metal layer; forming a dielectric layer on the first metal layer and the first circuit layer; forming a second metal layer on the dielectric layer; forming a plurality of conductive blind vias in the dielectric layer and forming a second circuit layer on the second metal layer, where the plurality of conductive blind vias are electrically connected to the first circuit layer and the second circuit layer; and removing the first metal layer and a portion of the second metal layer simultaneously. Therefore, in the manufacturing method, the first metal layer and the second metal layer can be removed by one etching process, such that the time for manufacturing the package substrate can be greatly reduced to increase production quantity.

Abstract: A package substrate and the manufacturing method thereof are provided. The method includes encapsulating a circuit layer and a conductive pillar on the circuit layer with an insulating layer, and then forming a groove in the insulating layer corresponding to the conductive pillar, so as to form a routing layer in the groove, so there is no need for drilling to make blind vias. Therefore, the alignment problem of conventional circuits and conductive blind vias can be avoided.

Abstract: An electronic package is provided, including a package substrate in which a circuit layer and a surface treatment layer are embedded in an insulating portion, and the surface treatment layer is coupled to a top surface of the circuit layer, but is not formed on a side surface of the circuit layer. Therefore, the circuit layer can maintain the original predetermined line spacing so that it is beneficial to be designed with fine line spacing/line width.

Abstract: A substrate structure is provided, in which an insulator encapsulates a conductive pillar that is a single solid pillar body, and at least one wiring layer electrically connected to the conductive pillar is arranged on the insulator. Therefore, the conductive pillar is designed as a single solid pillar body to meet the requirements of thin lines, fine spacing and high-density contacts.

Abstract: Embodiments disclosed herein relate to reducing a power consumption of an electronic device while maintaining some functionality of the electronic device while the electronic device is in a low power mode. The device may be in the low power mode due to a battery level being below a threshold. If the battery level is below the threshold, the electronic device may enter the low power mode. However, before entering the low power mode, some functionality of an application processor may be transferred to a communication controller. Once the functionality is transferred, the application processor may be disabled to reduce power consumption while maintaining functionality of the application processor. The electronic device may also utilize various communication protocols to communicate with a peripheral device. Even though the electronic device may be in the low power mode, the communication controller may be used to cause the peripheral device to perform various actions.

Abstract: Embodiments disclosed herein relate to reducing a power consumption of an electronic device while maintaining some functionality of the electronic device while the electronic device is in a low power mode. The device may be in the low power mode due to a battery level being below a threshold. If the battery level is below the threshold, the electronic device may enter the low power mode. However, before entering the low power mode, some functionality of an application processor may be transferred to a communication controller. Once the functionality is transferred, the application processor may be disabled to reduce power consumption while maintaining functionality of the application processor. The electronic device may also utilize various communication protocols to communicate with a peripheral device. Even though the electronic device may be in the low power mode, the communication controller may be used to cause the peripheral device to perform various actions.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

Abstract: A wireless power system may include an accessory configured to transfer or relay wireless power to a portable electronic device. The portable electronic device may include wireless charging circuitry and sensors configured to detect compatible accessories currently coupled with the portable electronic device. The portable electronic device performs wireless charging or related functions in accordance with the coupled accessories.

Abstract: A wireless power system may include an accessory configured to transfer or relay wireless power to a portable electronic device. The portable electronic device may include wireless charging circuitry and sensors configured to detect compatible accessories currently coupled with the portable electronic device. The portable electronic device performs wireless charging or related functions in accordance with the coupled accessories.

Abstract: Systems, methods, and computer-readable media for managing near field communications during a low power express mode of an electronic device are provided that may make credentials of a near field communication (“NFC”) component appropriately secure and appropriately accessible while also limiting the power consumption of the NFC component and of other components of the electronic device.

Abstract: A wireless power system may include an accessory configured to transfer or relay wireless power to a portable electronic device. The portable electronic device may include wireless charging circuitry and sensors configured to detect compatible accessories currently coupled with the portable electronic device. The portable electronic device performs wireless charging or related functions in accordance with the coupled accessories.

Abstract: Systems, methods, and computer-readable media for managing near field communications during a low power express mode of an electronic device are provided that may make credentials of a near field communication (“NFC”) component appropriately secure and appropriately accessible while also limiting the power consumption of the NFC component and of other components of the electronic device.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

Abstract: In one configuration, a semiconductor package includes a conductive trace embedded in a base and a semiconductor device mounted on the conductive trace via a conductive structure, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace. In another configuration, a method for fabricating a semiconductor package includes providing a base, forming at least one conductive trace on the base, forming an additional insulation material on the base, and defining patterns upon the additional insulation material, wherein the pattern is formed on at least one conductive trace, wherein the conductive structure is a bump structure and the width of the bump structure is bigger than the width of the conductive trace.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.