Abstract: An automated method is provided for enabling and implementing a beacon-based service location application in a user device having a beacon monitoring application. A service location facilitation server establishes service need criteria for a user of the user device and estimates a service need state for the user. The service need state includes information indicative of a relative need for a desired service. The service location facilitation server then determines whether the service need state meets the service need criteria, and, if so, transmits an instruction to the user device to transition the beacon monitoring application from an inactive state to an active monitoring state.

Abstract: An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.

Abstract: A plasma source is provided that is configured to form a section of a wall of a vacuum component. The plasma source comprises a body including a dielectric member, a first surface exposed to an exterior region of the vacuum component, and a second surface exposed to an interior region of the vacuum component. The plasma source also comprises at least one electrode disposed in a receiving channel of the body with at least a portion of the dielectric member located adjacent to the at least one electrode in the receiving channel. The plasma source further comprise at least one discharge region adjacent to the receiving channel within the body. The at least one discharge region is exposed to the interior region of the vacuum component via an opening on the second surface of the body.

Abstract: A material-actuated door includes a door housing including a flexible material; and one or more least one Shape Memory Alloy (SMA) actuators embedded in the door housing. Each SMA actuator is elastically biased in a first actuator physical state and is configured to transition into a second actuator physical state in response to receiving electrical current. The material-actuated door is transitioned into a first door position in response to disconnecting the electrical current to the at least one SMA actuator, and is transitioned into a second door position in response to delivering the electrical current to the at least one SMA actuator.

Abstract: One example method of operation may include collecting call metric data over a predefined period of time for identified calls, querying the call metric data to identify whether one or more call filtering criteria parameters require changes, determining one or more call filtering criteria parameters require changes based on a deviation from one or more expected call metric data values included in the call metric data, modifying one or more of the call filtering criteria parameters, and updating an active call scam model stored on a call processing server based on the one or more call filtering parameters.

Abstract: A boron-free slime-like composition can include polyethylene oxide, cellulose, a filler, and water.

Abstract: A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.

Abstract: A track tensioning system for adjusting tension in a vehicle track, comprising a track tensioner comprising a hydraulic cylinder and a piston assembly slidably moveable within the cylinder and dividing the cylinder into a first and second chamber each in selective fluid communication with a pressurised hydraulic fluid source and reservoir, such that supply or withdrawal of hydraulic fluid to or from the chambers causes the piston assembly to move within the cylinder in either extension, increasing track tension, or retraction, decreasing track tension, further comprising a locking system capable of mechanically locking the position of the piston assembly with respect to the hydraulic cylinder, wherein the locking system is switchable between an engaged mode, where it prevents movement of the piston, thereby maintaining tension in the vehicle track, and a disengaged mode, where it allows movement of the piston, thereby allowing tension in the vehicle track to be adjusted.

Abstract: A rotary servo valve comprising a housing portion (105) defining a cylindrical cavity (107) and a first layer of ports. The rotary servo valve further comprises two opposing indented sides and two opposing sides having an increased radius relative to the indented sides, each side of increased radius extending between the two indented sides. The spool portion (103) is mounted for rotation relative to the cylindrical cavity (107), from a neutral position so as to prevent fluid flow through the valve, to an open position in which a fluid flow path is provided.

Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.

Abstract: One example method of operation may include identifying a call from a caller and destined for a callee, receiving a data message associated with the call, forwarding the data message to a call processing server, processing the data message to identify one or more call parameters, comparing the one or more call parameters to an active call scam model applied by the call processing server, determining a scam score for the call based on the comparing of the one or more call parameters to the active call scam model applied by the call processing server, and determining whether to notify the callee that the call is a scam based on the scam score.

Abstract: A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.

Abstract: Embodiments described herein are related to systems and methods for offering an upgrade for a transportation service. In one aspect, a computer can receive a reservation request for a transportation service including an itinerary indicating a first location, a second location, and a first service category of the transportation service. The computer can determine a plurality of reposition estimates for a plurality of service categories including the first service category and one or more potential service categories, each reposition estimate being determined based upon the first location, the second location, and a particular service category. The computer can identify, as a second service category, the potential service category having the reposition estimate lower than the reposition estimate of the first service category in the reservation request. The computer can transmit to the client device an upgrade notification indicating an eligibility to update the itinerary to include the second service category.

Abstract: Embodiments disclosed herein include electronic packages with improved differential signaling architectures. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises alternating metal layers and dielectric layers. In an embodiment, a first trace is embedded in the package substrate, where the first trace has a first thickness that extends from a first metal layer to a second metal layer. In an embodiment, the electronic package further comprises a first ground plane laterally adjacent to a first side of the first trace, and a second ground plane laterally adjacent to a second side of the first trace.

Abstract: Various embodiments relate to a semiconductor package. The semiconductor package includes a first die. The first die includes a first bridge interconnect region. The semiconductor package further includes a second die. The second die includes a second bridge interconnect region. The semiconductor package includes a bridge die. The bridge die includes a first contact area to connect to the first bridge interconnect region and a second contact area to connect to the second bridge interconnect region. In the semiconductor package, the first bridge interconnect region is larger than the second bridge interconnect region. Additionally, each of the first bridge interconnect region and the second bridge interconnect region include a plurality of conductive bumps. An average pitch between adjacent bumps of the first bridge interconnect region is larger than an average pitch between adjacent bumps of the second bridge interconnect region.

Abstract: Apparatuses, devices and systems associated with semiconductor packages with chiplet and memory device coupling are disclosed herein. In embodiments, a semiconductor package may include a first chiplet, a second chiplet, and a memory device. The semiconductor package may further include an interconnect structure that couples the first chiplet to a first memory channel of the memory device and the second chiplet to a second memory channel of the memory device. Other embodiments may be described and/or claimed.

Abstract: One example method of operation may include collecting call metric data over a predefined period of time for identified calls, querying the call metric data to identify whether one or more call filtering criteria parameters require changes, determining one or more call filtering criteria parameters require changes based on a deviation from one or more expected call metric data values included in the call metric data, modifying one or more of the call filtering criteria parameters, and updating an active call scam model stored on a call processing server based on the one or more call filtering parameters.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for an interconnect hub for dies that includes a first side and a second side opposite the first side to couple with three or more dies, where the second side includes a plurality of electrical couplings to electrically couple at least one of the three or more dies to another of the three or more dies to facilitate data transfer between at least a subset of the three or more dies. The three or more dies may be tiled dies.

Abstract: Embodiments disclosed herein include disaggregated die modules. In an embodiment, a disaggregated die module comprises a plurality of core logic blocks. In an embodiment, the disaggregated die module further comprises a first IO interface, where the first IO interface is adjacent to an edge of the disaggregated die module, and a second IO interface, where the second IO interface is set away from the edge of the disaggregated die module.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, where the package substrate comprises: a core substrate. In an embodiment, the core substrate comprises glass. In an embodiment, a via passes through the core substrate. In an embodiment, a die is coupled to the package substrate, where the die comprises an IO interface. In an embodiment, the IO interface is electrically coupled to the via and the via is within a footprint of the die.