Abstract: A gate assembly for a bicycle race start includes a plurality of gates, each mounted in a separate start position along a bar to move between a closed position and an open position. The bar is moveable between a first condition and a second condition. The assembly includes buttresses, each coupled to the bar to move between first positions and second positions in response to movement of the bar between the first condition and the second condition, wherein each buttress corresponds to a respective one of the gates. In the first condition of the bar, each buttress disables movement of the respective gate from the closed position to the open position. In the second condition of the bar, each buttress enables movement of the respective gate from the closed position to the open position.

Abstract: A die storage method and apparatus comprising a cover tape and a strip coupled to the cover tape wherein the strip comprises a material that is: flexible or compressible, or combinations thereof.

Abstract: A die storage method and apparatus comprising a cover tape and a strip coupled to the cover tape wherein the strip comprises a material that is: flexible or compressible, or combinations thereof.

Abstract: A magnetic choir layout capable of enabling material erosion from a target providing a substantially uniform wear pattern.

Abstract: Embodiments of a carrier tape having an integrated cover tape are disclosed. The carrier tape may comprise a base having a number of spaced-apart pockets. A first cover tape piece and a second cover tape piece may each be secured to the carrier tape base. Opposing inner ends of the first and second cover tape pieces extend toward the center of the carrier tape base and over portions of the pockets, and a gap exists between these opposing inner edges. The gap overlies the pockets, but this gap is sized to retain parts within the pockets when the cover tape pieces are “at rest.” A separator tool may be inserted within this gap and underneath the first and second cover tape pieces, and this separator tool may spread apart the cover tape pieces, allowing parts to be removed from or placed in the carrier tape. Other embodiments are described and claimed.

Abstract: A method of singulating a microelectronic wafer. The method comprises: providing a microelectronic wafer; focusing a laser beam in an interior region of the wafer from the backside of the wafer to form a modified region extending along the severance lines of the wafer dividing the wafer IC chips, the modified region further extending from an undersurface of the active surface and ending at a predetermined depth with respect to the backside. The modified region comprises a plurality of modified sites of the wafer molten by the laser and resolidified. The method further includes reducing a thickness of the wafer in a direction from the backside toward the active surface by a reduction amount equal to at least the predetermined depth; and dividing the wafer into individual IC chips along the severance lines at the modified sites.

Abstract: Disclosed are embodiments of a carrier medium for integrated circuit die (or other components). The carrier medium may include a carrier tape and a heat shrinkable cover tape, the carrier tape including a number of spaced-apart die retaining areas along the length of this tape. Other embodiments are described and claimed.