Abstract: The present platen enables a component such as a surface-mount device to be held in close proximity to a contact heating source via vacuum suction. The platen comprises top and bottom thermally conductive surfaces with the top surface held in close proximity to the contact heating source, a through-hole which extends between the surfaces, and at least one groove recessed into the top surface which runs from a portion of the top surface that extends beyond the contact heating source to the through-hole, such that an applied vacuum is conveyed to the bottom surface via the grooves and through-hole. The bottom surface may include a rim around its perimeter; vacuum suction conveyed via the grooves and through-hole can hold a component to be heated against the rim, or within the recessed portion. The platen can be tailored for use with various component types, including PBGA and QFP SMDs.

Abstract: A thermal attach and detach method and system for surface-mounted components (SMCs) employs a planar-heater which generates heat in response to an electrical current. The heater's resistance varies with its temperature, and the resistance is read to determine heater and SMC temperature. A means of gripping an SMC is provided such that the device's I/O contacts are heated by thermal conduction from the planar-heater through and/or along the SMC's side-walls. An electrical current is provided to the planar-heater such that heat sufficient to attach/detach the I/O contacts to or from a PCB is generated. The method enables the gripping, heating, resistance monitoring and SMC temperature measuring to occur simultaneously. Several means of gripping an SMC are described, including vacuum, mechanical, adhesive and magnetic. A method which employs a heating element to heat a substrate on which SMCs may be mounted is also described.