Patents by Inventor Andrew G. Holland

Andrew G. Holland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages
    Patent number: 8304875
    Abstract: A semiconductor package comprising a first semiconductor sub-package (40) having a connection face (44) with un-supported connectors (21) depending therefrom arranged to electrically connect a first semiconductor device contained therein to an external circuit, and at least one second semiconductor sub-package (42) also having a connection face (46) with un-supported connectors (25) depending therefrom arranged to electrically connect a second semiconductor device contained therein to an external circuit, the second semiconductor sub-package (42) also having an attachment face (48), on an opposite side thereof from the connection face (46); wherein the second semiconductor sub-package (42) is mounted on the first semiconductor sub-package (40) such that its attachment face (48) is coupled to the connection face (44) of the first semiconductor sub-package (40).
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: November 6, 2012
    Assignee: RF Module and Optical Design Limited
    Inventor: Andrew G. Holland
  • SEMICONDUCTOR PACKAGES
    Publication number: 20100127372
    Abstract: A semiconductor package comprising a first semiconductor sub-package (40) having a connection face (44) with un-supported connectors (21) depending therefrom arranged to electrically connect a first semiconductor device contained therein to an external circuit, and at least one second semiconductor sub-package (42) also having a connection face (46) with un-supported connectors (25) depending therefrom arranged to electrically connect a second semiconductor device contained therein to an external circuit, the second semiconductor sub-package (42) also having an attachment face (48), on an opposite side thereof from the connection face (46); wherein the second semiconductor sub-package (42) is mounted on the first semiconductor sub-package (40) such that its attachment face (48) is coupled to the connection face (44) of the first semiconductor sub-package (40).
    Type: Application
    Filed: June 13, 2008
    Publication date: May 27, 2010
    Applicant: RF Module and Optical Design Limited
    Inventor: Andrew G. Holland