Patents by Inventor Andrew G. Laquer
Andrew G. Laquer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10854984Abstract: A method of manufacturing an integrated radio frequency (RF) module, comprising structurally forming at least one RF waveguide and at least one RF radiator of a metalized ceramic material. The RF waveguide(s) and the RF radiator(s) are connected and operatively coupled with each other. Each of the RF radiator(s) comprises a metalized outer wall and at least one metalized axial ridge extending along an inner surface of the outer wall. The method further comprises sintering the metalized ceramic material to create a monolithic structure comprising the RF waveguide and RF radiator, and operatively coupling RF circuitry to the RF waveguide(s).Type: GrantFiled: March 10, 2016Date of Patent: December 1, 2020Assignee: The Boeing CompanyInventors: Yong U. Kim, Andrew G. Laquer
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Publication number: 20170264011Abstract: A method of manufacturing an integrated radio frequency (RF) module, comprising structurally forming at least one RF waveguide and at least one RF radiator of a metalized ceramic material. The RF waveguide(s) and the RF radiator(s) are connected and operatively coupled with each other. Each of the RF radiator(s) comprises a metalized outer wall and at least one metalized axial ridge extending along an inner surface of the outer wall. The method further comprises sintering the metalized ceramic material to create a monolithic structure comprising the RF waveguide and RF radiator, and operatively coupling RF circuitry to the RF waveguide(s).Type: ApplicationFiled: March 10, 2016Publication date: September 14, 2017Inventors: Yong U. Kim, Andrew G. Laquer
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Patent number: 8937383Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.Type: GrantFiled: October 23, 2013Date of Patent: January 20, 2015Assignee: The Boeing CompanyInventors: Andrew G. Laquer, Ernest E. Bunch
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Publication number: 20140048236Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.Type: ApplicationFiled: October 23, 2013Publication date: February 20, 2014Applicant: The Boeing CompanyInventors: Andrew G. Laquer, Ernest E. Bunch
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Patent number: 8592971Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.Type: GrantFiled: December 15, 2009Date of Patent: November 26, 2013Assignee: The Boeing CompanyInventors: Andrew G. Laquer, Ernest E. Bunch
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Patent number: 7817100Abstract: A ballistic resistant antenna for use with a ballistic resistant communications system having a first plate fabricated from a ballistic material. The first plate has at least one opening configured to allow transmission of electromagnetic energy at a predetermined range of electromagnetic wavelengths. The antenna also has at least one plug having a geometry that is capable of insertion into the at least one opening. The at least one plug is made up of a material that is substantially transparent to the predetermined range of electromagnetic wavelengths.Type: GrantFiled: November 29, 2006Date of Patent: October 19, 2010Assignee: The Boeing CompanyInventors: Julio A. Navarro, Richard N. Bostwick, Andrew G. Laquer
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Publication number: 20100133685Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.Type: ApplicationFiled: December 15, 2009Publication date: June 3, 2010Applicant: THE BOEING COMPANYInventors: Andrew G. Laquer, Ernest E. Bunch
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Patent number: 7656025Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.Type: GrantFiled: November 21, 2006Date of Patent: February 2, 2010Assignee: The Boeing CompanyInventors: Andrew G. Laquer, Ernest E. Bunch
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Publication number: 20080122725Abstract: A ballistic resistant antenna for use with a ballistic resistant communications system having a first plate fabricated from a ballistic material. The first plate has at least one opening configured to allow transmission of electromagnetic energy at a predetermined range of electromagnetic wavelengths. The antenna also has at least one plug having a geometry that is capable of insertion into the at least one opening. The at least one plug is made up of a material that is substantially transparent to the predetermined range of electromagnetic wavelengths.Type: ApplicationFiled: November 29, 2006Publication date: May 29, 2008Applicant: THE BOEING COMPANYInventors: Julio A. NAVARRO, Richard N. BOSTWICK, Andrew G. LAQUER
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Publication number: 20080116568Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.Type: ApplicationFiled: November 21, 2006Publication date: May 22, 2008Inventors: Andrew G. Laquer, Ernest E. Bunch
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Patent number: 6360084Abstract: An RF transmitter, such as a radar transmitter or a communications amplifier, is provided that includes a plurality of RF power tube sections each sharing a common collector. The RF tube sections may comprise Klystron tubes, TWT tubes or other RF power tubes known in the art. A common modulator is also typically provided to modulate electron beams produced in each of the plurality of tube sections. The RF transmitter according to the present invention is considerably lighter and smaller relative to known multi-band RF transmitter structures that employ separate collectors and modulators. An associated RF amplification method that employs a common collector is also provided.Type: GrantFiled: November 3, 1999Date of Patent: March 19, 2002Assignee: The Boeing CompanyInventor: Andrew G. Laquer
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Patent number: 5167386Abstract: Pyrotechnic removal of a radome cover may be accomplished by scoring longitudinal recesses 50, preferably at least four, on the inner surface 26 of the cover 18. Explosives cord 38, shaped to preferentially detonate outward, is placed in the recesses 50, and is backed with a backing 48 to prevent damage to the underlying radome 12. Annular explosive cord sections 40 and 42 are placed at the nose 28 and rear end 20 of the radome cover 18. A detonator 34 explodes all cords simultaneously.Type: GrantFiled: January 21, 1992Date of Patent: December 1, 1992Assignee: Rockwell International CorporationInventors: Andrew G. Laquer, Albert L. Bien