Patents by Inventor Andrew Galpin
Andrew Galpin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10471567Abstract: A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.Type: GrantFiled: September 15, 2016Date of Patent: November 12, 2019Assignee: ENTEGRIS, INC.Inventors: Patrick Doering, Rajesh Tiwari, Andrew Galpin
-
Patent number: 10293463Abstract: A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.Type: GrantFiled: March 20, 2015Date of Patent: May 21, 2019Assignee: Entegris, Inc.Inventors: Andrew Galpin, Daniel Wells
-
Publication number: 20180071891Abstract: A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.Type: ApplicationFiled: September 15, 2016Publication date: March 15, 2018Inventors: Patrick Doering, Rajesh Tiwari, Andrew Galpin
-
Patent number: 9616547Abstract: A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.Type: GrantFiled: August 20, 2015Date of Patent: April 11, 2017Assignee: Entegris, Inc.Inventors: Joseph Smith, Andrew Galpin, Christopher Wargo
-
Publication number: 20170095903Abstract: A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. We have found that such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.Type: ApplicationFiled: March 20, 2015Publication date: April 6, 2017Inventors: Andrew GALPIN, Daniel WELLS
-
Publication number: 20160074993Abstract: A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.Type: ApplicationFiled: August 20, 2015Publication date: March 17, 2016Inventors: Joseph SMITH, Andrew GALPIN, Christopher WARGO
-
Patent number: 9132526Abstract: A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.Type: GrantFiled: March 6, 2012Date of Patent: September 15, 2015Assignee: Entegris, Inc.Inventors: Joseph Smith, Andrew Galpin, Christopher Wargo
-
Publication number: 20150087212Abstract: A pad conditioner for a CMP polishing pad. The pad conditioner includes a features having textured or roughened surfaces, with superabrasive grit seeds such as diamond interspersed on the roughened surface. A coating such as polycrystalline diamond can be applied over the surfaces and the grit seeds. In one embodiment, the coating has a thickness that is in the range of 50% to 100% of the larger superabrasive grit.Type: ApplicationFiled: May 6, 2013Publication date: March 26, 2015Inventors: Patrick Doering, Andrew Galpin
-
Publication number: 20140113532Abstract: A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface.Type: ApplicationFiled: March 6, 2012Publication date: April 24, 2014Applicant: ENTEGRIS, INC.Inventors: Joseph Smith, Andrew Galpin, Christopher Wargo
-
Patent number: 7753379Abstract: A gasket can include a body adapted to form a seal in an engagement region between two members. A first sealing portion can be formed in the body and define a first plane. A second sealing portion can be formed in the body and occupy a space outside of the first plane. A first transition portion is formed between the first and second portions. The first transition portion defines a first width in the engagement region that is greater than a second width defined in the first and second portion adjacent to the first transition portion.Type: GrantFiled: February 20, 2007Date of Patent: July 13, 2010Assignee: Freudenberg-NOK General PartnershipInventor: Andrew A. Galpin
-
Publication number: 20080265523Abstract: The asymmetric gasket counteracts the twisting tendency of a gasket in radiused portions. The design also energizes the seal in higher pressure applications to further increase the seal force and uniformity. The result is the minimization of potential for gasket roll and maximized seal pressure and stability. The gasket includes a gasket body having an upper surface and a lower surface each adapted to engage one of the two members being sealed. The gasket body has a radiused portion having an asymmetric cross section wherein the intermediate portion of the outboard surface extends radially outward from the outboard edges of the upper and lower surfaces to a greater extent than the intermediate portion of the inboard surface extends radially inward from the inboard edges of the upper and lower surfaces.Type: ApplicationFiled: April 30, 2007Publication date: October 30, 2008Applicant: FREUDENBERG-NOK GENERAL PARTNERSHIPInventor: Andrew A. Galpin
-
Publication number: 20080197581Abstract: A gasket can include a body adapted to form a seal in an engagement region between two members. A first sealing portion can be formed in the body and define a first plane. A second sealing portion can be formed in the body and occupy a space outside of the first plane. A first transition portion is formed between the first and second portions. The first transition portion defines a first width in the engagement region that is greater than a second width defined in the first and second portion adjacent to the first transition portion.Type: ApplicationFiled: February 20, 2007Publication date: August 21, 2008Applicant: FREUDENBERG-NOK GENERAL PARTNERSHIPInventor: Andrew A. Galpin