Patents by Inventor Andrew Grieder

Andrew Grieder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for high electrical and thermal performance ball grid array package
    Patent number: 6949823
    Abstract: A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film ceramic substrate with a first side and a second side with a heat spreader or a heat sink on the second side. An IC die may be attached to the heat spreader or heat sink through the laser cut die cavity and wire bonded to pads on the first side of the ceramic substrate. The thick film ceramic substrate may have one or more integrated passive components.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: September 27, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Donald E. Schott, Andrew Grieder, Joseph P. Groshong
  • METHOD AND APPARATUS FOR HIGH ELECTRICAL AND THERMAL PERFORMANCE BALL GRID ARRAY PACKAGE
    Publication number: 20050167819
    Abstract: A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film ceramic substrate with a first side and a second side with a heat spreader or a heat sink on the second side. An IC die may be attached to the heat spreader or heat sink through the laser cut die cavity and wire bonded to pads on the first side of the ceramic substrate. The thick film ceramic substrate may have one or more integrated passive components.
    Type: Application
    Filed: January 30, 2004
    Publication date: August 4, 2005
    Inventors: Donald Schott, Andrew Grieder, Joseph Groshong
  • High temperature eutectic solder ball attach
    Patent number: 6824041
    Abstract: High melt balls dispersed on the surface of a ball grid array package in such a manner that the collapse of eutectic solder balls is controlled during reflow heating in order to ensure appropriate solder ball standoff, pitch and coplanarity of the ball grid array package from the substrate or printed circuit board surface to which it is being attached.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: November 30, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Andrew Grieder, Alexander Lazar
  • High temperature eutectic solder ball attach
    Publication number: 20040074950
    Abstract: High melt balls dispersed on the surface of a ball grid array package in such a manner that the collapse of eutectic solder balls is controlled during reflow heating in order to ensure appropriate solder ball standoff, pitch and coplanarity of the ball grid array package from the substrate or printed circuit board surface to which it is being attached.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventors: Andrew Grieder, Alexander Lazar