Abstract: An apparatus and method for protecting integrated circuits from electrical overstress and eletrostatic discharge is provided. The apparatus includes a primary EOS/ESD protection device and a feedback circuit. The feedback circuit maintain the primary EOS/ESD protection device in an off state during normal operation of the integrated circuit and switches the primary protection device to an state when an EOS/ESD event occurs at a first input pad with respect to a second input pad of the integrated circuit.

Abstract: An electrical overstress (EOS) protection circuit for protecting an active circuit of an integrated circuit including first and second clamping circuits series connected between a first input and a first input/output of the EOS protection circuit and third and fourth clamping circuits connected between a first output of the protection circuit and a second input/output. In embodiments of the present invention an EOS protection circuit provides protection for an active circuit while enabling a voltage at an input pad to the active circuit to exceed a power supply reference by more than several volts and to be less than a ground reference by more than several volts.

Abstract: An electrical overstress (EOS) protection circuit includes a pair of contra-directed diode-connected bipolar EOS transistors connected between two integrated circuit (IC) terminals. One of the EOS transistors has a reverse-biased junction and the other has a forward-biased junction when a voltage is applied across the IC terminals. A pair of parasitic bipolar transistors are formed in series to provide a current path between the EOS transistors. When the voltage difference between the IC terminals exceeds the breakdown voltage of the EOS transistor with a reverse-biased junction as during an electrostatic discharge event, the parasitic transistors activate the EOS transistor with a reverse-biased junction to divert ESD current from the IC.

Abstract: An electrostatic discharge (ESD) protection circuit formed on a semiconductor substrate includes a first stage clamping circuit and a second stage clamping circuit separated by a dissipative circuit. The first and second stage clamping circuits are designed to absorb and dissipate the high and low energy ESD, respectively. The first clamping circuit has a self-regulated current mechanism capable of diverting the electrical current generated by an ESD from a high current density region to a low current density region within the semiconductor substrate, and simultaneously lowers the ESD induced voltage for safe protection.