Patents by Inventor ANDREW KEITH DICKERSON

ANDREW KEITH DICKERSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite electronics cases and methods of making and using the same
    Patent number: 10921859
    Abstract: A method of making an electronics enclosure that is light-weight, structurally sound and EMI resistant is provided. Preferably the electronics enclosure is made by covering the walls of a mold for the chassis and the lid with a metallic mesh. At least two plies of carbon prepreg are applied over the metallic mesh. The carbon prepreg and metallic mesh are then cured together at high temperature, typically in an autoclave. The wire mesh becomes integrated into the composite material during the curing process when the carbon material shrinks to the mold and the epoxy bonds with the wire mesh. The molds may then be removed leaving an electronics enclosure with superior properties.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: February 16, 2021
    Assignee: SECURAPLANE TECHNOLOGIES, INC.
    Inventors: Brandon Ross Mahoney, Sarajin Ali, Dennis Keith Moxley, Andrew Keith Dickerson, Thomas David Black
  • COMPOSITE ELECTRONICS CASES AND METHODS OF MAKING AND USING THE SAME
    Publication number: 20180299928
    Abstract: A method of making an electronics enclosure that is light-weight, structurally sound and EMI resistant is provided. Preferably the electronics enclosure is made by covering the walls of a mold for the chassis and the lid with a metallic mesh. At least two plies of carbon prepreg are applied over the metallic mesh. The carbon prepreg and metallic mesh are then cured together at high temperature, typically in an autoclave. The wire mesh becomes integrated into the composite material during the curing process when the carbon material shrinks to the mold and the epoxy bonds with the wire mesh. The molds may then be removed leaving an electronics enclosure with superior properties.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 18, 2018
    Inventors: BRANDON ROSS MAHONEY, SARAJIN ALI, DENNIS KEITH MOXLEY, ANDREW KEITH DICKERSON, THOMAS DAVID BLACK