Patents by Inventor Andrew Lee McNees
Andrew Lee McNees has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9132654Abstract: A packaging label for an inkjet printhead including a first label portion adapted for adhesion to a first surface of the inkjet printhead, and a second label portion adapted for adhesion to a second surface of the inkjet printhead. The second label portion has a forked configuration including a first outer portion, a second outer portion and a central portion disposed between the first and second outer portions and adapted for adhesion to a packaging tape adhered to a nozzle plate of the inkjet printhead. The adhesion between the second label portion and the second surface of the inkjet printhead is higher than the adhesion between the first label portion and the first surface of the inkjet printhead.Type: GrantFiled: July 8, 2014Date of Patent: September 15, 2015Assignee: Funai Electric Co., Ltd.Inventors: Paul W. Dryer, Jason Vanderpool, Richard Warner, David Bernard, Andrew Lee McNees
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Patent number: 8882221Abstract: A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.Type: GrantFiled: August 21, 2008Date of Patent: November 11, 2014Assignee: Funai Electric Co., Ltd.Inventors: David Laurier Bernard, Paul William Dryer, David Golman King, Andrew Lee McNees, Timothy Lowell Strunk
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Patent number: 8826502Abstract: A process for making a substantially planar micro-fluid ejection head is disclosed, and includes depositing a basic solution on a first surface of a device substrate. The first surface having the basic solution deposited thereon is contacted together with a surface of a support material for a duration ranging from about 1 minute to about 15 minutes, at a temperature ranging from about 20° C. to about 90° C. so that the first surface having the basic solution deposited thereon and the surface of the support material form a bond therebetween to hermetically seal the support material and the device substrate to one another. Both the substrate and the at least one surface of the support comprise silicon, and at least one of the device substrate and the at least one surface of the support material is substantially composed of silicon.Type: GrantFiled: May 25, 2010Date of Patent: September 9, 2014Assignee: Funai Electric Co., Ltd.Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Patent number: 8324076Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.Type: GrantFiled: May 25, 2010Date of Patent: December 4, 2012Assignee: Lexmark International, Inc.Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Patent number: 8087756Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.Type: GrantFiled: May 6, 2011Date of Patent: January 3, 2012Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Patent number: 8071275Abstract: A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.Type: GrantFiled: April 10, 2008Date of Patent: December 6, 2011Assignee: Lexmark International, Inc.Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Publication number: 20110205305Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.Type: ApplicationFiled: May 6, 2011Publication date: August 25, 2011Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Patent number: 7938513Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.Type: GrantFiled: April 11, 2008Date of Patent: May 10, 2011Assignee: Lexmark International, Inc.Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Patent number: 7815289Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.Type: GrantFiled: August 31, 2007Date of Patent: October 19, 2010Assignee: Lexmark International, Inc.Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Publication number: 20100230047Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.Type: ApplicationFiled: May 25, 2010Publication date: September 16, 2010Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Publication number: 20100229391Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.Type: ApplicationFiled: May 25, 2010Publication date: September 16, 2010Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Publication number: 20100045736Abstract: A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.Type: ApplicationFiled: August 21, 2008Publication date: February 25, 2010Inventors: David Laurier Bernard, Paul William Dryer, David Golman King, Andrew Lee McNees, Timothy Lowell Strunk
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Publication number: 20090256891Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Inventors: Frank Edward Anderson, David Laurier Bernard, Paul William Dryer, Burton Lee Joyner, II, Andrew Lee McNees, Timothy Lowell Strunk, Carl Edmond Sullivan
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Publication number: 20090258322Abstract: A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.Type: ApplicationFiled: April 10, 2008Publication date: October 15, 2009Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Publication number: 20090058945Abstract: A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.Type: ApplicationFiled: August 31, 2007Publication date: March 5, 2009Inventors: David Laurier Bernard, Paul William Dryer, Andrew Lee McNees
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Publication number: 20080083700Abstract: Methods for processing wafers, wafer processing apparatus, micro-fluid ejection head substrates, and etching process are provided. One such method includes applying a clamping voltage to an electrostatic chuck sufficient to hold a wafer in a substantially planerized orientation adjacent to the electrostatic chuck. A heat transfer fluid flows through a three dimensional space between the wafer and the electrostatic chuck to cool the wafer by convective heat transfer during wafer processing.Type: ApplicationFiled: November 21, 2006Publication date: April 10, 2008Applicant: LEXMARK INTERNATIONAL, INC.Inventors: David Laurier Bernard, Paul William Dryer, John William Krawczyk, Andrew Lee McNees, Girish Shivaji Patil, Richard Lee Warner
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Publication number: 20080007595Abstract: A micro-fluid ejection head structure, methods for making micro-fluid ejection head structures, and methods for etching polymeric nozzle plates. One such micro-fluid ejection head structuring includes a substrate having a plurality of fluid ejection actuators. A thick film layer is attached adjacent the substrate. The thick film layer has a fluid chamber and a fluid flow channel capable of providing fluid to the fluid chamber. A polymeric nozzle plate is attached adjacent the thick film layer. The polymeric nozzle plate includes a nozzle capable of being in fluid communication with one or more of the fluid flow chambers. The nozzle is a plasma etched nozzle defined by a photoresist mask layer.Type: ApplicationFiled: July 10, 2006Publication date: January 10, 2008Inventors: John William Krawczyk, Andrew Lee McNees, Girish Shivaji Patil
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Patent number: 7273266Abstract: A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.Type: GrantFiled: April 14, 2004Date of Patent: September 25, 2007Assignee: Lexmark International, Inc.Inventors: John William Krawczyk, Andrew Lee McNees, James Michael Mrvos, Carl Edmond Sullivan
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Patent number: 6902867Abstract: The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.Type: GrantFiled: October 2, 2002Date of Patent: June 7, 2005Assignee: Lexmark International, Inc.Inventors: Eric Spencer Hall, Shauna Marie Leis, Andrew Lee McNees, James Michael Mrvos, James Harold Powers, Carl Edmond Sullivan
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Publication number: 20040067446Abstract: The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.Type: ApplicationFiled: October 2, 2002Publication date: April 8, 2004Inventors: Eric Spencer Hall, Shauna Marie Leis, Andrew Lee McNees, James Michael Mrvos, James Harold Powers, Carl Edmond Sullivan