Abstract: A method and a resulting device for mounting a semiconductor to a submount by depositing a first layer of a first metal solder having a selected first melting point and corresponding thickness onto a surface of the semiconductor. Depositing a second layer of a second metal solder having a selected second melting point higher than the first melting point and a corresponding selected thickness onto a surface of the submount. Disposing the semiconductor surface and submount surface in confronting intimate contact and heating the submount and semiconductor to a temperature greater than the first temperature and lower that the second temperature for initiating and promoting liquid interdiffusion between the first and second solders.

Abstract: The present invention provides a linearization system (100) and method (700, 800) for generating a predistorted drive signal for a nonlinear transmission path. The linearization includes: A) an analog feedback system (39), coupled to a computation unit, for determining, during a training mode, a complex error signal that linearizes the nonlinear transmission path and wherein, in an operation mode, the analog feedback system is disabled; and B) a computation unit (1), coupled to the analog feedback system and coupled to receive a complex input signal and the complex error signal, for determining, during the training mode, complex predistortion gain coefficients and, during the operation mode, generating the predistorted drive signal for the nonlinear transmission path, wherein the analog feedback system and computation unit are interconnected by interface circuitry.