Abstract: A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures and temperatures than are possible using bulk or conventional thin-film gasket materials.

Abstract: A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures and temperatures than are possible using bulk or conventional thin-film gasket materials.

Abstract: A business method for distributing gifts. The method employs a gift wrap which is marked with a specific code number. The wrap is sold by an originator to a customer who places a gift within the wrap and mails or delivers the package to a first recipient. The customer inputs to the originator's website information comprising the wrap's code number, his name and address and the name and address of the first recipient. Then the first recipient inputs to the website information comprising the code number, his name and address and the name and address of any other recipient to whom the same wrap is sent with another gift. The information is sorted and stored in a database. The customer and first and any subsequent recipient of a wrap access the website over the internet to view the track history of the wrap.

Abstract: A magnetofluiddynamic (MFD) pump including a liquid (or partially liquid) piston and at least two valve-delimited chambers is disclosed. The valve-delimited chambers may be coupled, in series or parallel, between the input and the output of a fluid passage to provide either intermittent flow of the working fluid or substantially continuous working fluid flow. In at least one embodiment, a piston chamber housing a conductive liquid (e.g. liquid) piston is coupled to two valve-delimited chambers so that a single stroke of the piston both draws working fluid into one of the chambers and pushes working fluid out of the other chamber.

Abstract: In certain embodiments, a thermoelectric device apparatus includes a plurality of laterally spaced-apart electrodes disposed upon a supporting structure, and at least one complementary pair of thermoelectric elements, each thermoelectric element coupling an electrode to a laterally adjacent electrode. Such a structure reduces the need for solder joints or other structures or mechanisms to attach multiple substrates, components, or assemblies together to form a thermoelectric device.

Abstract: A module in accordance with the present invention includes at least one electromagnetic pump and a power supply circuit for the electromagnetic pump. The tight coupling between the pump and its power supply afford more easily driving the pump with a low voltage, high current output of the power supply, and ease of integration in system design.

Abstract: A fluidic apparatus and method for cooling a non-uniformly heated heat source such as an integrated circuit. The apparatus preferentially cools a non-uniformly heated integrated circuit. A coolant is introduced into a high-power region of the integrated circuit through an inlet. The coolant absorbs heat from this region and cools it. Thereafter, the coolant is transferred to the low-power region of the integrated circuit. After the coolant absorbs heat from the low-power region, it is removed from an outlet, which is connected to the low-power region of the integrated circuit.

Abstract: A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.

Abstract: A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g.