Patents by Inventor Andrew Minnick
Andrew Minnick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240188892Abstract: Systems and methods are disclosed for autonomously soothing babies. An example method may include receiving a first sound input from a microphone, processing the first sound input, determining a baby status based at least in part on the first sound input, determining an output action based at least in part on the baby status; and implementing the output action at the children's apparatus.Type: ApplicationFiled: February 13, 2024Publication date: June 13, 2024Inventors: Alexander Walter Minnicks, Zachary Rubin, Bradley Keith Hondros, Mubeen Ahmad, William Andrew Steer, Justin Pinkney, Bart A. Smudde, Brian S. Kelly
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Patent number: 11676872Abstract: A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.Type: GrantFiled: June 10, 2020Date of Patent: June 13, 2023Assignee: MENLO MICROSYSTEMS, INC.Inventors: Jaeseok Jeon, Christopher F. Keimel, Chris Nassar, Andrew Minnick
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Publication number: 20230064520Abstract: A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.Type: ApplicationFiled: October 14, 2022Publication date: March 2, 2023Inventors: Andrew Minnick, Christopher F. Keimel, Xu Zhu
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Patent number: 11501928Abstract: A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.Type: GrantFiled: March 27, 2020Date of Patent: November 15, 2022Assignee: MENLO MICROSYSTEMS, INC.Inventors: Andrew Minnick, Christopher F. Keimel, Xu Zhu
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Publication number: 20210391228Abstract: A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.Type: ApplicationFiled: June 10, 2020Publication date: December 16, 2021Inventors: Jaeseok Jeon, Christopher F. Keimel, Chris Nassar, Andrew Minnick
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Publication number: 20210304973Abstract: A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.Type: ApplicationFiled: March 27, 2020Publication date: September 30, 2021Inventors: Andrew Minnick, Christopher F. Keimel, Xu Zhu
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Patent number: 9845235Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.Type: GrantFiled: September 3, 2015Date of Patent: December 19, 2017Assignee: General Electric CompanyInventors: Joleyn Eileen Brewer, Christopher Fred Keimel, Marco Francesco Aimi, Andrew Minnick, Renner Stephen Ruffalo
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Publication number: 20170066645Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.Type: ApplicationFiled: September 3, 2015Publication date: March 9, 2017Inventors: Joleyn Eileen Brewer, Christopher Fred Keimel, Marco Francesco Aimi, Andrew Minnick, Renner Stephen Ruffalo
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Patent number: 6260894Abstract: A blade assembly for a mechanical wafer handling system. The assembly includes an elongated planar member having a central region, wherein the central region has a first array of openings and a second array of openings, the openings of the first array being arranged substantially symmetrically to the openings of the second array on opposing sides of a central longitudinal axis extending along the length of the planar member and passing through a center point of the central region. The openings in the first array are arranged substantially symmetrically with respect to a perpendicular axis extending along the width of the elongated planar member and passing through a center point of the central region. The openings in the second array are also arranged substantially symmetrically with respect to the perpendicular axis. The assembly also includes a wrist with a wrist upper cap and a wrist lower cap.Type: GrantFiled: May 28, 1999Date of Patent: July 17, 2001Assignee: Applied Materials, Inc.Inventors: Andrew Minnick, James Wilson, Abhilash J. Mayur