Abstract: A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.

Abstract: In an enclosure, electrical connections to a bulkhead connector may be made using a flex spring. The flex spring may have a frame and one or more spring members supported at their proximal ends by the frame. At their distal ends, the spring members may be configured to apply a distributed load to compress a set of contacts on a flex assembly against a corresponding set of contacts on a bulkhead connector. The pressure applied by the flex spring may be distributed to make reliable electrical connection between the corresponding sets of contacts. In one embodiment, the frame of the flex spring may be attached to a flex bracket. The flex bracket may mount to a wall of a base to which the bulkhead connector is mounted.

Abstract: An interface to make interconnections between the interior and exterior of a sealed enclosure may include a flat connector (FC). The FC may comprise at least one layer of a substantially planar substrate. Each substrate layer may include metallization for conducting signals between contacts on an interior-facing surface and contacts on an exterior-facing surface. In an enclosure with an aperture for passing electrical conductors, the FC may be configured to seal the aperture to inhibit the escape of a low density gas, such as helium, for a long period of time. In one embodiment, the FC may include metallization configured to minimize helium leakage. As such, the FC may conduct electrical signals into and out of the sealed enclosure. Such signals may include, for example, power, control, and data signals for operating devices housed within the enclosure.