Abstract: Liquid fabric care compositions that include certain fabric treatment adjuncts and/or water, where the compositions further include capsules characterized by substantially inorganic shells, for example silica-based shells. The present disclosure further relates to methods of making and using such compositions.

Abstract: The present disclosure relates to methods of differentiating pluripotent stem cells into endothelial cells. The present disclosure also relates to endothelial cells made by such methods, organoids containing such endothelial cells, and methods of use thereof. The present disclosure also relates to differentiation media for use in the same.

Abstract: Antiperspirant and deodorant compositions that include capsules characterized by substantially inorganic shells. The present disclosure further relates to methods of making and using such compositions.

Abstract: Liquid fabric care compositions that include certain fabric treatment adjuncts and/or water, where the compositions further include capsules characterized by substantially inorganic shells, for example silica-based shells. The present disclosure further relates to methods of making and using such compositions.

Abstract: A receiver, transmitter, and photon counting detector for use in an optical communication link are disclosed. Also disclosed are methods of communicating using the transmitter, the receiver, and the photon detector.

Abstract: A receiver, transmitter, and photon counting detector for use in an optical communication link are disclosed. Also disclosed are methods of communicating using the transmitter, the receiver, and the photon detector.

Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.

Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.

Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.

Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.

Abstract: A thermally stable small optical package is disclosed housing optically aligned elements forming an optical component. The elements are all directly soldered to a base member or directly soldered to a supporting member soldered to a common base member. The sealed container has a supporting base member of stainless steel and a first optical fiber mount is directly soldered to the supporting base. A first optical fiber is directly soldered to the upper end of the first optical fiber mount. A similar arrangement is provided wherein a second optical fiber mount is directly soldered to the base and a second optical fiber is directly soldered to the upper end of the second optical fiber mount. A frequency doubling crystal is directly soldered to the stainless steel base member after being aligned with the two optical fibers. This design is inexpensive to manufacture and provides a thermally stable component.