Abstract: A radio frequency (RF) module may comprise: (a) a substrate including a plurality of integral waveguides formed therein, each of the plurality of waveguides orthogonally-oriented with respect to the one or more adjacent waveguides; and (b) a plurality of antenna radiator elements attached to the dielectric substrate and oriented such that a pair of antenna radiator elements is electrically coupled to one of the plurality of waveguides. Each of the integral waveguides is electrically coupled to electrical circuitry of the RF module.

Abstract: A radio frequency (RF) module may comprise: (a) a substrate including a plurality of integral waveguides formed therein, each of the plurality of waveguides orthogonally-oriented with respect to the one or more adjacent waveguides; and (b) a plurality of antenna radiator elements attached to the dielectric substrate and oriented such that a pair of antenna radiator elements is electrically coupled to one of the plurality of waveguides. Each of the integral waveguides is electrically coupled to electrical circuitry of the RF module.

Abstract: A radio frequency (RF) module may comprise: (a) a substrate including a plurality of integral waveguides formed therein, each of the plurality of waveguides orthogonally-oriented with respect to the one or more adjacent waveguides; and (b) a plurality of antenna radiator elements attached to the dielectric substrate and oriented such that a pair of antenna radiator elements is electrically coupled to each waveguide. Each of the integral waveguides is electrically coupled to electrical circuitry of the RF module.

Abstract: An ultrathin, low cost, beamformer with excellent RF performance and robust coaxial connections is disclosed. The beamformer includes a dielectric substrate sheet with a beamformer circuit, a preform sheet adjacent to the substrate sheet, and a conductive backing plate sandwiching the preform as well as an RF absorber. The beamformer also includes robust input and output coaxial connections in which the heads of the coaxial input and output pins are captured between the conductive backing plate and the substrate sheet and ground shrouds are attached to the dielectric substrate sheet.