Patents by Inventor Andrew Sawle

Andrew Sawle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mounted package with die bottom spaced from support board
    Publication number: 20050224960
    Abstract: A semiconductor package according to the present invention includes a metal can which receives in its interior space a MOSFET. The MOSFET so received is oriented such that its drain electrode is facing the bottom of the can and is electrically connected to the same by a layer of conductive epoxy or a solder or the like. The edges of the MOSFET so placed are spaced from the walls of the can. The space between the edges of the MOSFET and the walls of the can is filled with an insulating layer. A surface of the MOSFET is sub-flush below the plane of a substrate by 0.001-0.005 inches to reduce temperature cycling failures.
    Type: Application
    Filed: June 7, 2005
    Publication date: October 13, 2005
    Inventors: Martin Standing, Andrew Sawle
  • Solderable top metalization and passivation for source mounted package
    Publication number: 20050200011
    Abstract: A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
    Type: Application
    Filed: November 5, 2004
    Publication date: September 15, 2005
    Inventors: Martin Standing, Andrew Sawle, Matthew Elwin, David Jones, Martin Carroll, Ian Wagstaffe