Patents by Inventor Andrew Spendlove

Andrew Spendlove has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfers with minimal transfer marking on performance fabrics
    Patent number: 9701153
    Abstract: Heat transfers are provided that have indicia for labeling or enhancing the appearance of performance fabric material, such as apparel including sportswear fabrics with elastomeric characteristics. The label assembly includes a support portion with a label carrier layer and a release coating, along with a transfer portion over the support portion release coating that includes an ink design and a hot melt adhesive layer. The hot melt adhesive layer securely transfers the ink design to the fabric at relatively low temperature and pressure conditions for a relatively low dwell time.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: July 11, 2017
    Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
    Inventors: Yi-Hung Chiao, Liviu Dinescu, Andrew Spendlove, Johannes Yttri, Osman N. Tanrikulu, Ben T. O'Brien
  • HEAT TRANSFERS WITH MINIMAL TRANSFER MARKING ON PERFORMANCE FABRICS
    Publication number: 20160009124
    Abstract: Heat transfers are provided that have indicia for labeling or enhancing the appearance of performance fabric material, such as apparel including sportswear fabrics with elastomeric characteristics. The label assembly includes a support portion with a label carrier layer and a release coating, along with a transfer portion over the support portion release coating that includes an ink design and a hot melt adhesive layer. The hot melt adhesive layer securely transfers the ink design to the fabric at relatively low temperature and pressure conditions for a relatively low dwell time.
    Type: Application
    Filed: December 29, 2014
    Publication date: January 14, 2016
    Inventors: Yi-Hung Chiao, Liviu Dinescu, Andrew Spendlove, Johannes Yttri, Osman N. Tanrikulu, Ben T. O'Brien