Abstract: A side airbag for use in a vehicle includes a main chamber extending along a ceiling of the vehicle and configured to restrain a head of a vehicle occupant when the airbag is deployed. The main chamber includes an inboard panel and an outboard panel that are joined together. The airbag also includes a forward chamber extending from the main chamber and configured to restrain at least a portion of the vehicle occupant when the airbag is deployed. The forward chamber at least partially overlaps at least one of the inboard and outboard panels of the main chamber when the airbag is stowed.

Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

Abstract: A side airbag extends along a side of an interior roof of a vehicle and is configured to restrain a head of a vehicle occupant when the airbag is deployed. The airbag includes an inboard panel, an outboard panel, and one or more seams configured to join the inboard panel and the outboard panel. The at least one or more seams include first seam portions and second seam portions. The first seam portions are subject to higher stress than the second seam portions when the airbag inflates. The first seam portions are reinforced by sewing or by at least one bead of energy absorbent sealant or adhesive.

Abstract: An airbag is provided which includes at least one fabric panel and a structural seam. The structural seam includes an adhesive but does not include stitching. Such stitching tends to weaken the fabric of airbags and causes a higher denier fabric with higher strength to be used to offset the loss in strength, but this in turn produces an airbag of greater weight due to the high denier fabric. By providing an airbag with a structural seam provided by an adhesive without stitching, an airbag may be lighter and may be inflated in less time.

Abstract: The disclosed airbag device for a vehicle may comprise an airbag and at least one connection member. The airbag may have first and second side surfaces, wherein the first side surface has upper and lower ends. The at least one connection member may connect the lower end of the first side surface to an intermediate position on the first side surface located between the upper and lower ends of the first side surface.

Abstract: An airbag is provided. The airbag is configured to extend longitudinally along a side of a vehicle and includes a first section configured to inflate in a longitudinal and vertical direction, a second section coupled to the first section and configured to inflate in a longitudinal and vertical direction, an inlet for receiving inflation gas from an inflator, tabs positioned at the top of the airbag for attaching the airbag to a ceiling of the vehicle and chambers positioned between the tabs along the top of the airbag, wherein the chambers stabilize the airbag during deployment.

Abstract: A side airbag extends along a side of an interior roof of a vehicle and is configured to restrain a head of a vehicle occupant when the airbag is deployed. The airbag includes an inboard panel, an outboard panel, and one or more seams configured to join the inboard panel and the outboard panel. The at least one or more seams include first seam portions and second seam portions. The first seam portions are subject to higher stress than the second seam portions when the airbag inflates. The first seam portions are reinforced by sewing or by at least one bead of energy absorbent sealant or adhesive.

Abstract: A side airbag for use in a vehicle includes a main chamber extending along a ceiling of the vehicle and configured to restrain a head of a vehicle occupant when the airbag is deployed. The main chamber includes an inboard panel and an outboard panel that are joined together. The airbag also includes a forward chamber extending from the main chamber and configured to restrain at least a portion of the vehicle occupant when the airbag is deployed. The forward chamber at least partially overlaps at least one of the inboard and outboard panels of the main chamber when the airbag is stowed.

Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

Abstract: The disclosed airbag device for a vehicle may comprise an airbag and at least one connection member. The airbag may have first and second side surfaces, wherein the first side surface has upper and lower ends. The at least one connection member may connect the lower end of the first side surface to an intermediate position on the first side surface located between the upper and lower ends of the first side surface.

Abstract: An airbag is provided. The airbag is configured to extend longitudinally along a side of a vehicle and includes a first section configured to inflate in a longitudinal and vertical direction, a second section coupled to the first section and configured to inflate in a longitudinal and vertical direction, an inlet for receiving inflation gas from an inflator, tabs positioned at the top of the airbag for attaching the airbag to a ceiling of the vehicle and chambers positioned between the tabs along the top of the airbag, wherein the chambers stabilize the airbag during deployment.

Abstract: Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

Abstract: The disclosed airbag assembly is for use in a vehicle. The airbag assembly may comprise an airbag and a carrier mechanism. The airbag may comprise an inflatable cushion for protecting a vehicle occupant. The carrier mechanism may be attached to the airbag for fastening the airbag to the vehicle.

Abstract: Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

Abstract: A fuel cell sub-assembly includes first and second flow field plates each comprising several fastener apertures defined at a number of fastening locations. A membrane electrode assembly is situated between the first and second flow field plates and includes several fastener apertures defined at a number of fastening locations, the respective fastener apertures aligned to define fastening holes. A form-in-place fastener formed of an elastomeric material is disposed in each of the fastening holes. The elastomeric material facilitates volumetric displacement of the form-in-place fasteners in response to placing the fuel cell sub-assembly in compression.

Abstract: A technique includes pulse width modulating an illuminating beam of a light to establish a pixel intensity and modulating the illuminating beam to create different tonal resolution ranges for the pixel intensity.

Abstract: A technique includes pulse width modulating a beam of a light to establish a pixel intensity. The technique includes controlling a light source to modulate an illumination of the beam to create different tonal resolution ranges for the pixel intensity.

Abstract: A fuel cell cathode catalyst is provided which comprises nanostructured elements comprising microstructured support whiskers bearing nanoscopic catalyst particles. The nanoscopic catalyst particles are made by the alternating application of first and second layers, the first layer comprising platinum and the second layer being an alloy or intimate mixture of iron and a second metal selected from the group consisting of Group VIb metals, Group VIIb metals and Group VIIIb metals other than platinum and iron, where the atomic ratio of iron to the second metal in the second layer is between 0 and 10, where the planar equivalent thickness ratio of the first layer to the second layer is between 0.3 and 5, and wherein the average bilayer planar equivalent thickness of the first and second layers is less than 100 ?.