Abstract: A multilevel mirror plate suitable for use with a torsional hinged mirror assembly is laser milled to provide a more effective truss structure in less time and at a reduced cost.

Abstract: A method for increasing the resonant frequency of a torsional hinged device having a reduced attaching area between the torsional hinges and the supporting anchors. The resonant frequency is increased by adding a material over the reduced area to stiffen the connection between the torsional hinges and the support anchors.

Abstract: A torsional hinged resonant device having an improved anchor support for providing inertia drive. The area by the anchors connecting the torsional hinges to the support member are thinned to have a reduced cross section. The reduced or thinned area increases flexibility such that less force is required to generate a desired angular rotation.

Abstract: System and method for operating four resonant torsional hinged mirrors such as torsional hinged MEMS devices at the same oscillating frequency suitable for use in a color printer requiring four serially arranged line printers.

Abstract: An oscillating torsional hinged device, such as a mirror, having the advantages of an oscillating device with permanent magnets mounted on the hinges, but without excessive size is disclosed. The permanent magnets are mounted in the areas of the anchor members rather than directly on the hinges.

Abstract: System and method for generating lines of data on a photosensitive medium for use with a display or a printing apparatus. The lines of data are generated by two or more modulated and parallel laser light beams onto a resonant pivoting torsional hinged mirror. The pivoting mirror sweeps the two modulated light beams back and forth across the photosensitive medium to provide bi-directional printing. Relative motion between the photosensitive medium and the plane of the sweeping light beam is provided by moving the photosensitive medium when used with a printing apparatus or by also orthogonally moving the sweeping plane of the light beams when used with a display device.

Abstract: A magnetic drive for providing pivotal motion to a functional surface, such as a mirror. The magnetic drive may be used to drive any torsional hinged device, but is particularly suitable for driving a torsional hinged mirror. According to a first embodiment, a dual axis functional surface uses a first pair of torsional hinges to provide primary movement to the functional surface and a second pair of torsional hinges provides movement orthogonal to the primary movement to allow positioning in two directions. The mass and movement of inertia of the functional surface is reduced by relocating permanent magnet sets to the axis of rotation. The reduced mass and movement of inertia results in a stiff robust hinge having a resonant frequency above about 120 Hz.

Abstract: A multilayered torsional hinged scanning mirror including a hinge layer with a mirror attaching member pivotally supported by torsional hinges. A mirror layer is bonded to the front side of the attaching member and a back layer is bonded to the back side of the attaching member. The mirror layer and the back layer are equal in mass and weight to balance the moment of inertia and stresses on the torsional hinges. The back layer may be a permanent magnet if the mirror oscillating drive is a magnetic drive. Alternately, the back layer may be another silicon slice.

Abstract: System and method for establishing and maintaining resonant oscillations of a torsional hinged device such as a pivotally hinged mirror. The system and methods comprise a permanent magnet mounted to the pivoting mirror that interacts with an electromagnetic coil. The magnetic coil is periodically connected and disconnected from a DC power supply in response to a series of drive pulses having a timing and duration such that the magnetic forces generated by the interaction of the permanent magnet and the electromagnetic coil maintains resonant oscillations of the device.

Abstract: A laser printer using a single frequency resonant mirror for providing the beam sweep for printing at a multiplicity of printing speeds. According to a first embodiment, a pair of torsional hinges 54a and 54b provides the resonant beam sweep. The number of line images per unit of measurement is changed as a function of printer speeds to achieve the desired image proportions.

Abstract: A laser printer using a single frequency resonant mirror for providing the beam sweep for printing at a multiplicity of printing speeds. According to a first embodiment, a pair of torsional hinges 54a and 54b provides the resonant beam sweep. The number of line images per unit of measurement is changed as a function of printer speeds to achieve the desired image proportions.

Abstract: System and method for establishing and maintaining resonant oscillations of a torsional hinged device such as a pivotally hinged mirror. The system and methods comprise a permanent magnet mounted to the pivoting mirror that interacts with an electromagnetic coil.

Abstract: A multilayered torsional hinged scanning mirror including a hinge layer with a mirror attaching member pivotally supported by torsional hinges. A mirror layer is bonded to the front side of the attaching member and a back layer is bonded to the back side of the attaching member. The mirror layer and the back layer are equal in mass and weight to balance the moment of inertia and stresses on the torsional hinges. The back layer may be a permanent magnet if the mirror oscillating drive is a magnetic drive. Alternately, the back layer may be another silicon slice.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.