Patents by Inventor Andrew T. Ryan

Andrew T. Ryan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7949017
    Abstract: A multimode-fiber Raman laser includes a pump source configured to provide optical radiation centered at a pump wavelength and characterized by a spectral bandwidth greater than 100 MHz and an oscillator resonant at an emission wavelength greater than the pump wavelength. The oscillator includes an input coupler optically aligned with the pump source and a multimode optical fiber optically coupled to the input coupler. The multimode optical fiber includes an input section having a fiber Bragg grating, an intracavity section of a predetermined length optically coupled to the input section, and an output section having a fiber Bragg grating. The oscillator also includes an output coupler optically coupled to the multimode optical fiber and configured to provide a laser output at the emission wavelength.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: May 24, 2011
    Assignee: Redwood Photonics
    Inventors: John R. Marciante, Andrew T. Ryan
  • Patent number: 7653109
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 26, 2010
    Assignee: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim W. Li, Nina D. Morozova
  • Publication number: 20090225793
    Abstract: A multimode-fiber Raman laser includes a pump source configured to provide optical radiation centered at a pump wavelength and characterized by a spectral bandwidth greater than 100 MHz and an oscillator resonant at an emission wavelength greater than the pump wavelength. The oscillator includes an input coupler optically aligned with the pump source and a multimode optical fiber optically coupled to the input coupler. The multimode optical fiber includes an input section having a fiber Bragg grating, an intracavity section of a predetermined length optically coupled to the input section, and an output section having a fiber Bragg grating. The oscillator also includes an output coupler optically coupled to the multimode optical fiber and configured to provide a laser output at the emission wavelength.
    Type: Application
    Filed: March 9, 2009
    Publication date: September 10, 2009
    Applicant: Redwood Photonics
    Inventors: John R. Marciante, Andrew T. Ryan
  • Patent number: 7235150
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: June 26, 2007
    Assignee: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim W. Li, Nina D. Morozova
  • Publication number: 20040105611
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: July 9, 2003
    Publication date: June 3, 2004
    Applicant: Gemfire Corporation
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B. Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim Weijian Li, Nina D. Morozova
  • Publication number: 20020110328
    Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 15, 2002
    Inventors: William K. Bischel, David K. Wagner, Harald Guenther, Simon J. Field, Markus P. Hehlen, Richard B Tompane, Andrew T. Ryan, C. Geoffrey Fanning, Jim Weijian Li, Nina D. Morozova