Patents by Inventor Andrew W. BRUNO

Andrew W. BRUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Isolation testing of semiconductor devices
    Patent number: 9188634
    Abstract: One example apparatus for isolation testing of semiconductor devices may include an interface portion for making electrical contact with packaged semiconductor devices under test. The interface portion may include an insulating support configured and dimensioned to support multiple semiconductor device packages, each semiconductor device package having a plurality of electrical contacts. The interface portion may further include a first electrically conductive surface to electrically contact a first proper subset of the plurality of electrical contacts of each of the semiconductor device packages supported by the interface portion and a second electrically conductive surface to electrically contact a second proper subset of the plurality of electrical contacts of each of the semiconductor device packages supported by the insulating support.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 17, 2015
    Assignee: Power Integrations, Inc.
    Inventor: Andrew W. Bruno
  • ISOLATION TESTING OF SEMICONDUCTOR DEVICES
    Publication number: 20140266284
    Abstract: Methods and apparatus for isolation testing of semiconductor devices are disclosed. One example apparatus may include an interface portion for making electrical contact with packaged semiconductor devices under test. The interface portion may include an insulating support configured and dimensioned to support multiple semiconductor device packages, each semiconductor device package having a plurality of electrical contacts. The interface portion may further include a first electrically conductive surface to electrically contact a first proper subset of the plurality of electrical contacts of each of the semiconductor device packages supported by the interface portion and a second electrically conductive surface to electrically contact a second proper subset of the plurality of electrical contacts of each of the semiconductor device packages supported by the insulating support.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: POWER INTEGRATIONS, INC.
    Inventor: Andrew W. BRUNO