Patents by Inventor Andrew Z. Glevatsky

Andrew Z. Glevatsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for creating a connection within a multilayer circuit board assembly
    Patent number: 6612025
    Abstract: A method for forming connections within a multi-layer electronic circuit board 10. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: September 2, 2003
    Assignee: Visteon Global Tech., Inc.
    Inventors: Zhong-You (Joe) Shi, Lakhi N. Goenka, Andrew Z. Glevatsky