Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract: A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad.

Abstract: A flexible mirror assembly is provided. The mirror assembly includes a mold line structure unit having a flexible mirror surface secured to a flexible panel. An actuator induces deformation of the flexible mirror surface such that it alters an angle at which the mirror surface reflects light.

Abstract: A vehicle jack adapted to be mounted to a vehicle chassis is provided. In one embodiment, the jack comprises a base member, a guide member, a flexible rod, and an actuator. One end of the rod is fixedly attached to the base member while a second end is slideably disposed within a passageway defined by the guide member. The actuator forces the flexible rod to deform by causing the second end of the rod to move with respect to the passageway. When mounted to a vehicle chassis, the jack is operated by deforming the flexible rod until a support surface, such as the ground, is encountered, and subsequently continuing to deform the rod until the vehicle becomes elevated. A vehicle jacking system incorporating the jacks of the invention is also provided.

Abstract: A vent assembly that can be concealed when in a closed configuration is provided In one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.

Abstract: A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.

Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract: An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract: Disclosed herein is a method and apparatus for splicing flexible circuit boards, particularly those having one or more flexible strip extensions with conductor runs. The splice clamp of the present invention has two hinged plates that clamp over unconnected ends of two flexible circuit board segments. The splice clamp includes alignment guides for aligning the segments in the clamp so that one or more jumpers contact and provide an electrical bridge between the conductors of the segments when the plates are clamped together. The jumpers contact conductive pads of larger size than the conductor runs to ensure electrical coupling between the flexible circuit board segments. The jumpers may have pointed tips that cut through insulation. The clamp includes flexible clasps on one plate that engage with catch surfaces on the other plate to lock the flexible circuit board segments spliced together.

Abstract: There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.

Abstract: A method of attaching a flexible plastic film having electronic circuit traces to a rigid plastic substrate. The film and substrate are made from different incompatible plastic materials that do not bond to one another and have different CTE. The use of different or incompatible materials is useful where the properties of the backing structure and film are selected to achieve different results. For example, the flexible film may be selected from a material that provides a high melting point to withstand soldering while the backing material is selected from a low-cost and light weight plastic material that has a lower melting point. The film has conductive traces on at least one surface thereof and a backing surface. A heat activated adhesive is applied to the backing surface. The film is placed within an open injection mold and the mold is closed. A hot plastic resin is injected into the mold adjacent the adhesive.

Abstract: A three-dimensional multi-layer electronic device and method for manufacturing same, wherein the device comprises a three-dimensional substrate including a conductive trace on at least one surface of the substrate, a thin layer of dielectric material substantially covering a desired portion of the conductive trace(s) on the substrate, the dielectric layer including vias at selected locations, and applying a coating of conductive material on the dielectric layer and in the vias, and defining a conductive trace in the material to thereby form a multi-layer, interconnected three-dimensional electronic device. Additional layers of dielectric material and conductive traces may be similarly applied to create the desired number of circuit layers. Molded-in structural features, and/or vias may be defined in the appropriate layers to accommodate the attachment and/or interconnection of other electronic devices to the device.

Abstract: There is disclosed herein an intake manifold for a port-injected internal combustion engine, comprising: a manifold body 10 having an interior plenum 12, and a runner 14 extending outward from the manifold body 10, wherein the runner 14 has a distal end 16 and a passage 18 therethrough in communication with the plenum 12. The distal end 16 of the runner 14 has a socket 20 therein into which an EFI 50 may be operatively mounted, and a first keying feature 22 formed therein for aligning the EFI in a first predetermined orientation when the EFI is engaged with the socket 20 and keying feature 22. The manifold may further include a second keying feature 42 formed in the runner end 16 for aligning a coil-on-plug spark plug ignition coil 80 in a second predetermined orientation when the coil 80 is engaged with the second keying feature 42.

Abstract: A circuit board assembly is disclosed comprising a pair of three-dimensional substrates having integral, metallized connectors. The connector of the first substrate protrudes therefrom, while the connector of the second substrate is recessed therein. The geometries of the protruding connector and the recessed connector are different such that they deform when assembled to provide an electrical connection and a detachable physical connection. In one embodiment, the recessed connector has a parabolic cross-section and the protruding connector has a circular cross-section. A flexible molded edge connector for the circuit board assembly is also disclosed.

Abstract: A circuit board includes a substantially non-conductive substrate and first and second rigid sheets. The first sheet forms a grid pattern substantially encapsulated by the substrate, and a portion of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet is also substantially encapsulated by the substrate and has a portion which extends beyond the boundary of the substrate to form a second interconnection terminal. The second sheet acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate.

Abstract: There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.

Abstract: A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.

Abstract: A method of supporting an electrical circuit on an electrically insulative base substrate comprises embossing a first circuit pattern on the substrate, and plating or etching a second circuit pattern over the first circuit pattern such that the first and second circuit patterns are in physical contact with each other for electrical communication therebetween. Plated through-holes are provided for facilitating support of a twisted pair of electrical conductors on a base substrate.