Abstract: The present invention relates to the use of an additive as well as a process to improve the adhesion of a mortar to a building substrate, wherein the mortar is mixed with said additive and is applied to a building substrate selected from the group of polystyrene-containing substrates, polyolefin-containing substrates or polyvinyl chloride-containing substrates, the additive containing (i) a plasticizer that is liquid at 50° C. or lower, has a boiling point of 100° C. or higher, and that has a solubility parameter ? 25° C. between 22.5 MPa1/2 and MPa1/2; (ii) optionally, a filler that has a BET surface area of at least 40 m2/g; (iii) optionally, a biopolymer, (iv) optionally, a protective colloid; and (v) optionally, a water-insoluble film-forming (co)polymer based on ethylenically unsaturated monomers. The invention also covers an additive and a kit of parts suitable for use in the above process.

Abstract: The present invention relates to the use of an additive as well as a process to improve the adhesion of a mortar to a building substrate, wherein the mortar is mixed with said additive and is applied to a building substrate selected from the group of polystyrene-containing substrates, polyolefin-containing substrates or polyvinyl chloride-containing substrates, the additive containing (i) a plasticizer that is liquid at 50° C. or lower, has a boiling point of 100° C. or higher, and that has a solubility parameter ? 25° C. between 22.5 MPa1/2 and MPa1/2; (ii) optionally, a filler that has a BET surface area of at least 40 m2/g; (iii) optionally, a biopolymer, (iv) optionally, a protective colloid; and (v) optionally, a water-insoluble film-forming (co)polymer based on ethylenically unsaturated monomers. The invention also covers an additive and a kit of parts suitable for use in the above process.

Abstract: The present invention relates to the use of an additive as well as a process to improve the adhesion of a mortar to a building substrate, wherein the mortar is mixed with said additive and is applied to a building substrate selected from the group of polystyrene-containing substrates, polyolefin-containing substrates or polyvinyl chloride-containing substrates, the additive containing (i) a plasticizer that is liquid at 50° C. or lower, has a boiling point of 100° C. or higher, and that has a solubility parameter ? 25° C. between 22.5 MPa1/2 and MPa1/2; (ii) optionally, a filler that has a BET surface area of at least 40 m2/g; (iii) optionally, a biopolymer, (iv) optionally, a protective colloid; and (v) optionally, a water-insoluble film-forming (co)polymer based on ethylenically unsaturated monomers. The invention also covers an additive and a kit of parts suitable for use in the above process.