Patents by Inventor Andrzej Samulak

Andrzej Samulak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11668795
    Abstract: A radar system includes a transmitting element adapted to transmit a radar signal, a receiving element adapted to receive a reflected signal of the radar signal being transmitted by the transmitting element, and a radome covering the transmitting element and the receiving element and having an inner surface and an outer surface. The inner surface of the radome faces the transmitting element and the receiving element. The radome comprises a recess being located at the inner surface.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: June 6, 2023
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Armin Talai, Andrzej Samulak, Leonardi Roberto
  • Publication number: 20210025971
    Abstract: A radar system includes a transmitting element adapted to transmit a radar signal, a receiving element adapted to receive a reflected signal of the radar signal being transmitted by the transmitting element, and a radome covering the transmitting element and the receiving element and having an inner surface and an outer surface. The inner surface of the radome faces the transmitting element and the receiving element. The radome comprises a recess being located at the inner surface.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 28, 2021
    Inventors: Armin TALAI, Andrzej SAMULAK, Leonardi ROBERTO
  • Patent number: 9666543
    Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: May 30, 2017
    Assignee: Infineon Technologies AG
    Inventors: Saverio Trotta, Jagjit Singh Bal, Ulrich Moeller, Andrzej Samulak, Werner Simbuerger
  • Publication number: 20150305190
    Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.
    Type: Application
    Filed: April 17, 2015
    Publication date: October 22, 2015
    Inventors: Saverio Trotta, Jagjit Singh Bal, Ulrich Moeller, Andrzej Samulak, Werner Simbuerger