Patents by Inventor Andy Chien-Hsiang Chen

Andy Chien-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11909373
    Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: February 20, 2024
    Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
    Inventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
  • Publication number: 20210111702
    Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 15, 2021
    Inventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes