Patents by Inventor Andy Daiber

Andy Daiber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6763047
    Abstract: Laser apparatus and methods that use active thermal adjustment of an external laser cavity to minimize losses and provide wavelength stability and provide wavelength tuning. The apparatus comprise a thermally conductive platform, a gain medium thermally coupled to the platform, the gain medium having a first facet emitting a first light beam from the first facet, and a reflective element positioned in the first light beam and coupled to the platform, the reflective element and the second facet defining an external laser cavity. The reflective element is mounted on the platform and may be thermally coupled to the platform. Selective thermal control of the external cavity optical path length during laser operation is provided by heating and cooling of the thermally conductive platform.
    Type: Grant
    Filed: June 15, 2002
    Date of Patent: July 13, 2004
    Assignee: Intel Corporation
    Inventors: Andy Daiber, Mark McDonald
  • Publication number: 20030231666
    Abstract: Laser apparatus and methods that use active thermal adjustment of an external laser cavity to minimize losses and provide wavelength stability and provide wavelength tuning. The apparatus comprise a thermally conductive platform, a gain medium thermally coupled to the platform, the gain medium having a first facet emitting a first light beam from the first facet, and a reflective element positioned in the first light beam and coupled to the platform, the reflective element and the second facet defining an external laser cavity. The reflective element is mounted on the platform and may be thermally coupled to the platform. Selective thermal control of the external cavity optical path length during laser operation is provided by heating and cooling of the thermally conductive platform.
    Type: Application
    Filed: June 15, 2002
    Publication date: December 18, 2003
    Inventors: Andy Daiber, Mark McDonald