Patents by Inventor Andy Price
Andy Price has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230367047Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: ApplicationFiled: July 14, 2023Publication date: November 16, 2023Applicant: STMicroelectronics (Research & Development) LimitedInventors: Kevin CHANNON, James Peter Drummond DOWNING, Andy PRICE
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Patent number: 11747529Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: GrantFiled: November 5, 2021Date of Patent: September 5, 2023Assignee: STMicroelectronics (Research & Development) LimitedInventors: Kevin Channon, James Peter Drummond Downing, Andy Price
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Patent number: 11693149Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: GrantFiled: August 25, 2021Date of Patent: July 4, 2023Assignees: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, STMICROELECTRONICS PTE LTDInventors: Wing Shenq Wong, Andy Price, Eric Christison
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Publication number: 20220057553Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: ApplicationFiled: November 5, 2021Publication date: February 24, 2022Applicant: STMicroelectronics (Research & Development) LimitedInventors: Kevin CHANNON, James Peter Drummond DOWNING, Andy PRICE
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Publication number: 20210382197Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: ApplicationFiled: August 25, 2021Publication date: December 9, 2021Applicants: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, STMICROELECTRONICS PTE LTDInventors: Wing Shenq WONG, Andy PRICE, Eric CHRISTISON
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Patent number: 11187837Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: GrantFiled: October 7, 2019Date of Patent: November 30, 2021Assignee: STMicroelectronics (Research & Development) LimitedInventors: Kevin Channon, James Peter Drummond Downing, Andy Price
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Patent number: 11137517Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: GrantFiled: June 2, 2020Date of Patent: October 5, 2021Assignees: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, STMICROELECTRONICS PTE LTDInventors: Wing Shenq Wong, Andy Price, Eric Christison
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Publication number: 20200301042Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: ApplicationFiled: June 2, 2020Publication date: September 24, 2020Inventors: Wing Shenq WONG, Andy PRICE, Eric CHRISTISON
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Patent number: 10684389Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: GrantFiled: August 21, 2018Date of Patent: June 16, 2020Assignees: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, STMICROELECTRONICS PTE LTDInventors: Wing Shenq Wong, Andy Price, Eric Christison
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Publication number: 20200041704Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: ApplicationFiled: October 7, 2019Publication date: February 6, 2020Applicant: STMicroelectronics (Research & Development) LimitedInventors: Kevin CHANNON, James Peter Drummond DOWNING, Andy PRICE
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Patent number: 10473834Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: GrantFiled: November 21, 2016Date of Patent: November 12, 2019Assignee: STMicroelectronics (Research & Development) LimitedInventors: Kevin Channon, James Peter Drummond Downing, Andy Price
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Publication number: 20190004207Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: ApplicationFiled: August 21, 2018Publication date: January 3, 2019Inventors: Wing Shenq Wong, Andy Price, Eric Christison
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Patent number: 10061057Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: GrantFiled: August 21, 2015Date of Patent: August 28, 2018Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITEDInventors: Wing Shenq Wong, Andy Price, Eric Christison
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Publication number: 20180143359Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.Type: ApplicationFiled: November 21, 2016Publication date: May 24, 2018Inventors: Kevin CHANNON, James Peter Drummond DOWNING, Andy PRICE
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Patent number: 9876973Abstract: An optical module for use in a device includes an array of pixels configured to capture image data and a memory. The memory is configured to store identification information associated with said optical module. The identification information enables retrieval of information for controlling said optical module from a source outside said device.Type: GrantFiled: December 28, 2015Date of Patent: January 23, 2018Assignee: STMicroelectronics (Research & Development) LimitedInventor: Andy Price
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Publication number: 20170052277Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.Type: ApplicationFiled: August 21, 2015Publication date: February 23, 2017Inventors: Wing Shenq Wong, Andy Price, Eric Christison
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Publication number: 20160112666Abstract: An optical module for use in a device includes an array of pixels configured to capture image data and a memory. The memory is configured to store identification information associated with said optical module. The identification information enables retrieval of information for controlling said optical module from a source outside said device.Type: ApplicationFiled: December 28, 2015Publication date: April 21, 2016Inventor: Andy Price
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Patent number: 9310247Abstract: An imaging circuit includes at least one photosensitive device that provides an output in response to at least one photon and a compensation circuit configured to provide dark current compensation for the output of said photosensitive device. The applied compensation uses temperature information and temperature dependent calibration information.Type: GrantFiled: May 27, 2014Date of Patent: April 12, 2016Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITEDInventors: Jeffrey M. Raynor, Andy Price
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Publication number: 20140353471Abstract: An imaging circuit includes at least one photosensitive device that provides an output in response to at least one photon and a compensation circuit configured to provide dark current compensation for the output of said photosensitive device. The applied compensation uses temperature information and temperature dependent calibration information.Type: ApplicationFiled: May 27, 2014Publication date: December 4, 2014Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITEDInventors: Jeffrey M. Raynor, Andy Price
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Patent number: 7156724Abstract: An arcuate, preferably cylindrical, magnetic shunt bar supports a plurality of pin magnets having alternate north and south orientations, defining a ring-shaped array of magnets of alternating orientation. The magnet free ends opposite the shunt bar are positioned to conform closely to the shape of a surface to be sealed, forming a narrow gap therebetween containing a multi-polar magnetic field extending beyond the free ends in a direction substantially orthogonal to the surface. The axes of the magnets may be disposed at any desired angular orientation to the surface. Magnetorheological fluid (MRF) in the gap is magnetically stiffened and held as a dynamic seal. The arrangement is useful as a shaft seal, wherein the seal surface passes axially through the array, and also as a wiper for MRF from a carrier surface wherein the surface passes by the array.Type: GrantFiled: December 15, 2004Date of Patent: January 2, 2007Assignee: QED Technologies International, Inc.Inventors: William Kordonski, Andy Price, Jerry Carapella, Arpad Sekeres