Patents by Inventor Angela Wieneke Kessler

Angela Wieneke Kessler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 7791177
    Abstract: Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads connected to the first major surface, and a thickness of encapsulation material disposed on the first major surface of the carrier. Each lead extends through the thickness of the encapsulation material.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: September 7, 2010
    Assignee: Infineon Technologies AG
    Inventors: Angela Wieneke Kessler, Wolfgang Schober, Roman Peters
  • Semiconductor device including a stress buffer
    Patent number: 7612457
    Abstract: An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in electrical communication with the active area, and a ceramic inorganic stress-buffering layer disposed between the active area and the bond pad.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: November 3, 2009
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Alfred Haimerl, Angela Wieneke Kessler, Michael Bauer
  • ELECTRONIC DEVICE
    Publication number: 20090146272
    Abstract: Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads connected to the first major surface, and a thickness of encapsulation material disposed on the first major surface of the carrier. Each lead extends through the thickness of the encapsulation material.
    Type: Application
    Filed: December 10, 2007
    Publication date: June 11, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Angela Wieneke Kessler, Wolfgang Schober, Roman Peters
  • SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER
    Publication number: 20080315438
    Abstract: An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in electrical communication with the active area, and a ceramic inorganic stress-buffering layer disposed between the active area and the bond pad.
    Type: Application
    Filed: June 21, 2007
    Publication date: December 25, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Alfred Haimerl, Angela Wieneke Kessler, Michael Bauer