Patents by Inventor Angelo FERRO

Angelo FERRO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190342425
    Abstract: There is described herein a system for autonomous content optimization for the adaptation of graphical interactive content on hardware and devices, utilizing behavioral and performance data across a network to optimize or improve quality and performance on the hardware and devices. In accordance with an embodiment, the ACO system can be configured to autonomously take content for a specific software application and make it perform optimally across a plurality of device types and operating systems and settings.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 7, 2019
    Inventors: John Cheng, Lauren Brooke Kearny, Elie El Noune, Angelo Ferro, Yao Li, Rolando Andrés Abarca Millán
  • Patent number: 9551080
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 24, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde, Timo Bangerter, Angelo Ferro, Andreas Kirbs, Andre Schmökel, Dirk Rohde, Stefanie Ackermann
  • Publication number: 20150299883
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Application
    Filed: November 12, 2013
    Publication date: October 22, 2015
    Inventors: Heiko BRUNNER, Bernd ROELFS, Agnieszka WITCZAK, Lars KOHLMANN, Olivier MANN, Christian OHDE, Timo BANGERTER, Angelo FERRO, Andreas KIRBS, Andre SCHMÖKEL, Dirk ROHDE, Stefanie ACKERMANN