Patents by Inventor Angelo Gulino

Angelo Gulino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
    Publication number: 20240021565
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 18, 2024
    Inventors: Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
  • Solder material and method for die attachment
    Patent number: 11842974
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: December 12, 2023
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
  • SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
    Publication number: 20200203304
    Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
    Type: Application
    Filed: May 11, 2018
    Publication date: June 25, 2020
    Inventors: Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
  • Cooling devices and methods of using them
    Publication number: 20050151554
    Abstract: A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.
    Type: Application
    Filed: July 15, 2004
    Publication date: July 14, 2005
    Applicant: Cookson Electronics, Inc.
    Inventors: Alan Rae, Bawa Singh, William Varnell, Angelo Gulino, Mitch Holtzer, Joe Abys, Brian Lewis
  • Cooling devices and methods of using them
    Publication number: 20050151555
    Abstract: A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body optionally with one or more voids. In certain examples, a cooling medium that can receive, absorb or extract heat from the electronic component and/or the surrounding environment is disposed on or in the cooling device body. In some examples, a cooling device that includes a polymeric cooling device body, optionally with tape disposed on the polymeric cooling device body, is disclosed.
    Type: Application
    Filed: September 17, 2004
    Publication date: July 14, 2005
    Applicant: Cookson Electronics, Inc.
    Inventors: Brian Lewis, Siman Slim, Angelo Gulino