Abstract: A molded package with a leadframe locking structure is shown. A lower leadframe consists of a frame member, a connecting element extending therefrom, a mounting member at the distal end of the connecting element, and at least one side element projecting from the mounting member. Electrical connection is made between the mounting member and a semiconductor device. An upper leadframe consists of a frame member and an extending lead element which makes electrical contact with an upper surface of the semiconductor device. There is at least one side element bent up to a predetermined angle relative to the mounting member so that an encapsulant will be locked in place, minimizing the possibility of semiconductor contamination via boundaries between the encapsulant and the leadframes. The encapsulant, such as plastic or epoxy, is transfer or injection molded over the lead element, over the semiconductor device, about the side element, and on top of the mounting member to form the completed package.