Patents by Inventor Anh N. Nguyen
Anh N. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230005765Abstract: Exemplary semiconductor processing systems may include a processing chamber. The systems may include a remote plasma unit coupled with the processing chamber. The systems may include an adapter coupled between the remote plasma unit and the processing chamber. The adapter may be characterized by a first end and a second end opposite the first end. The remote plasma unit may be coupled with the adapter at the first end. The adapter may define a first central channel extending more than 50% of a length of the adapter from the first end of the adapter. The adapter may define a second central channel extending less than 50% of the length of the adapter from the second end of the adapter. The adapter may define a transition between the first central channel and the second central channel.Type: ApplicationFiled: July 2, 2021Publication date: January 5, 2023Applicant: Applied Materials, Inc.Inventors: Son T. Nguyen, Kenneth D. Schatz, Anh N. Nguyen, Soonwook Jung, Ryan Pakulski, Anchuan Wang, Zihui Li
-
Patent number: 11322337Abstract: A workpiece carrier is described for a plasma processing chamber that has isolated heater plate blocks. In one example, a plasma processing system has a plasma chamber, a plasma source electrically coupled with a showerhead included within the plasma chamber, a workpiece holder in a processing region of the plasma chamber having a puck to carry a workpiece, wherein the workpiece holder includes a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, wherein each block includes a heater to heat a respective block of the heater plate, and wherein the workpiece holder includes a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate defining a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, and a temperature controller to independently control each heater.Type: GrantFiled: May 12, 2017Date of Patent: May 3, 2022Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Son T. Nguyen, Anh N. Nguyen, David Palagashvili
-
Patent number: 10829855Abstract: Embodiments disclosed herein generally relate to a gas distribution assembly for providing improved uniform distribution of processing gases into a semiconductor processing chamber. The gas distribution assembly includes a gas distribution plate, a blocker plate, and a dual zone showerhead. The gas distribution assembly provides for independent center to edge flow zonality, independent two precursor delivery, two precursor mixing via a mixing manifold, and recursive mass flow distribution in the gas distribution plate.Type: GrantFiled: April 20, 2017Date of Patent: November 10, 2020Assignee: Applied Materials, Inc.Inventors: Anh N. Nguyen, Dmitry Lubomirsky, Mehmet Tugrul Samir
-
Patent number: 10577690Abstract: Embodiments disclosed herein generally relate to a gas distribution assembly for providing improved uniform distribution of processing gases into a semiconductor processing chamber. The gas distribution assembly includes a gas distribution plate, a blocker plate, and a dual zone showerhead. The gas distribution assembly provides for independent center to edge flow zonality, independent two precursor delivery, two precursor mixing via a mixing manifold, and recursive mass flow distribution in the gas distribution plate.Type: GrantFiled: April 20, 2017Date of Patent: March 3, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Anh N. Nguyen, Dmitry Lubomirsky, Mehmet Tugrul Samir
-
Patent number: 10431435Abstract: A wafer carrier is described with independent isolated heater zones. In one example, the carrier has a puck to carry a workpiece for fabrication processes, a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, and each having a heater to heat a respective block of the heater plate, and a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate.Type: GrantFiled: February 4, 2015Date of Patent: October 1, 2019Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Son T. Nguyen, Anh N. Nguyen, David Palagashvill
-
Publication number: 20180005856Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: ApplicationFiled: September 18, 2017Publication date: January 4, 2018Inventors: Anzhong CHANG, Paul BRILLHART, Surajit KUMAR, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON, Steve ABOAGYE, Anh N. NGUYEN, Kailash Kiran PATALAY, Joseph M. RANISH, Oleg V. SEREBRYANOV, Dongming IU, Shu-Kwan LAU, Zuoming ZHU, Herman DINIZ
-
Publication number: 20170335457Abstract: Embodiments disclosed herein generally relate to a gas distribution assembly for providing improved uniform distribution of processing gases into a semiconductor processing chamber. The gas distribution assembly includes a gas distribution plate, a blocker plate, and a dual zone showerhead. The gas distribution assembly provides for independent center to edge flow zonality, independent two precursor delivery, two precursor mixing via a mixing manifold, and recursive mass flow distribution in the gas distribution plate.Type: ApplicationFiled: April 20, 2017Publication date: November 23, 2017Inventors: Anh N. NGUYEN, Dmitry LUBOMIRSKY, Mehmet Tugrul SAMIR
-
Publication number: 20170335456Abstract: Embodiments disclosed herein generally relate to a gas distribution assembly for providing improved uniform distribution of processing gases into a semiconductor processing chamber. The gas distribution assembly includes a gas distribution plate, a blocker plate, and a dual zone showerhead. The gas distribution assembly provides for independent center to edge flow zonality, independent two precursor delivery, two precursor mixing via a mixing manifold, and recursive mass flow distribution in the gas distribution plate.Type: ApplicationFiled: April 20, 2017Publication date: November 23, 2017Inventors: Anh N. NGUYEN, Dmitry LUBOMIRSKY, Mehmet Tugrul SAMIR
-
Patent number: 9768043Abstract: Embodiments of the present disclosure relate to a dome assembly. The dome assembly includes an upper dome including a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: GrantFiled: December 18, 2013Date of Patent: September 19, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Anzhong Chang, Paul Brillhart, Surajit Kumar, Satheesh Kuppurao, Mehmet Tugrul Samir, David K. Carlson, Steve Aboagye, Anh N. Nguyen, Kailash Kiran Patalay, Joseph M. Ranish, Oleg Serebryanov, Dongming Iu, Shu-Kwan Lau, Zuoming Zhu, Herman Diniz
-
Patent number: 9766022Abstract: A method and apparatus for heating or cooling a fluid is provided. In one embodiment, a heat exchanger is provided. The heat exchanger includes a first subassembly comprising an insert. The insert comprises a body having a blind passage formed axially in the body, a plurality of nozzles formed therein, and a first plurality of heat exchange elements disposed within the body. The heat exchanger also comprises a second subassembly comprising a sleeve and a second plurality of heat exchange elements disposed within the sleeve, wherein the insert is sealably engaged inside the sleeve and the insert and the sleeve cooperatively define a thin gap, and wherein each of the plurality of nozzles are disposed radially between the blind passage and the thin gap.Type: GrantFiled: November 2, 2012Date of Patent: September 19, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Tao Hou, Son T. Nguyen, Kenric T. Choi, Anh N. Nguyen
-
Publication number: 20170250060Abstract: A workpiece carrier is described for a plasma processing chamber that has isolated heater plate blocks. In one example, a plasma processing system has a plasma chamber, a plasma source electrically coupled with a showerhead included within the plasma chamber, a workpiece holder in a processing region of the plasma chamber having a puck to carry a workpiece, wherein the workpiece holder includes a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, wherein each block includes a heater to heat a respective block of the heater plate, and wherein the workpiece holder includes a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate defining a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, and a temperature controller to independently control each heater.Type: ApplicationFiled: May 12, 2017Publication date: August 31, 2017Inventors: Dmitry Lubomirsky, Son T. Nguyen, Anh N. Nguyen, David Palagashvili
-
Patent number: 9312154Abstract: Embodiments of the invention provide improved apparatus for depositing layers on substrates, such as by chemical vapor deposition (CVD). The inventive apparatus disclosed herein may advantageously facilitate one or more of depositing films having reduced film thickness non-uniformity within a given process chamber, improved particle performance (e.g., reduced particles on films formed in the process chamber), chamber-to-chamber performance matching amongst a plurality of process chambers, and improved process chamber serviceability.Type: GrantFiled: April 20, 2010Date of Patent: April 12, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Binh Tran, Anqing Cui, Bernard L. Hwang, Son T. Nguyen, Anh N. Nguyen, Sean M. Seutter, Xianzhi Tao
-
Publication number: 20160035544Abstract: A wafer carrier is described with independent isolated heater zones. In one example, the carrier has a puck to carry a workpiece for fabrication processes, a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, and each having a heater to heat a respective block of the heater plate, and a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate.Type: ApplicationFiled: February 4, 2015Publication date: February 4, 2016Inventors: Dmitry Lubomirsky, Son T. Nguyen, Anh N. Nguyen, David Palagashvill
-
Patent number: 9175394Abstract: Embodiments of the invention relate to apparatus and methods for depositing materials on substrates during atomic layer deposition processes. In one embodiment, a chamber lid assembly comprises a channel having an upper portion and a lower portion, wherein the channel extends along a central axis, a housing having an inner region and at least partially defining two or more annular channels, an insert disposed in the inner region and defining the upper portion, the upper portion fluidly coupled with the two or more annular channels, and a tapered bottom surface extending from the bottom portion of the channel to a peripheral portion of the chamber lid assembly.Type: GrantFiled: March 8, 2011Date of Patent: November 3, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Joseph Yudovsky, Anh N. Nguyen, Tai T. Ngo
-
Publication number: 20140199056Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.Type: ApplicationFiled: December 18, 2013Publication date: July 17, 2014Inventors: Anzhong CHANG, Paul BRILLHART, Surajit KUMAR, Satheesh KUPPURAO, Mehmet Tugrul SAMIR, David K. CARLSON, Steve ABOAGYE, Anh N. NGUYEN, Kailash Kiran PATALAY, Joseph M. RANISH, Oleg SEREBRYANOV, Dongming IU, Shu-Kwan LAU, Zuoming ZHU, Herman DINIZ
-
Publication number: 20130058637Abstract: A method and apparatus for heating or cooling a fluid is provided. In one embodiment, a heat exchanger is provided. The heat exchanger includes a first subassembly comprising an insert. The insert comprises a body having a blind passage formed axially in the body, a plurality of nozzles formed therein, and a first plurality of heat exchange elements disposed within the body. The heat exchanger also comprises a second subassembly comprising a sleeve and a second plurality of heat exchange elements disposed within the sleeve, wherein the insert is sealably engaged inside the sleeve and the insert and the sleeve cooperatively define a thin gap, and wherein each of the plurality of nozzles are disposed radially between the blind passage and the thin gap.Type: ApplicationFiled: November 2, 2012Publication date: March 7, 2013Inventors: Tao Hou, Son T. Nguyen, Kenric T. Choi, Anh N. Nguyen
-
Patent number: 8382897Abstract: Methods for gas delivery to a process chamber are provided herein. In some embodiments, a method may include flowing a process gas through one or more gas conduits, each gas conduit having an inlet and an outlet for facilitating the flow of gas through the gas conduits and into a gas inlet funnel having a second volume, wherein each gas conduit has a first volume less than the second volume, and wherein each gas conduit has a cross-section that increases from a first cross-section proximate the inlet to a second cross-section proximate the outlet but excluding any intersection points between the gas inlet funnel and the gas conduit, and wherein the second cross-section is non-circular; and delivering the process gas to the substrate via the gas inlet funnel.Type: GrantFiled: April 25, 2012Date of Patent: February 26, 2013Assignee: Applied Materials, Inc.Inventors: Kedarnath Sangam, Anh N. Nguyen
-
Patent number: 8309874Abstract: A method and apparatus for heating or cooling a fluid. An inlet conduit coupled to a plurality of distribution nozzles in fluid communication with a channel at the periphery of the apparatus. An insert and a sleeve cooperatively define a thin gap, in fluid communication with the channel, through which the fluid flows. Thermal inserts near the thin gap generate heat flux into or out of the fluid, which exits through an outlet conduit.Type: GrantFiled: May 16, 2008Date of Patent: November 13, 2012Assignee: Applied Materials, Inc.Inventors: Tao Hou, Son T. Nguyen, Kenric Choi, Anh N. Nguyen
-
Publication number: 20120225191Abstract: Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising at least one gas injector unit. Each gas injector unit comprises a plurality of elongate gas injectors including at least two first reactive gas injectors and at least one second reactive gas injector, the at least two first reactive gas injectors surrounding the at least one second reactive gas injector. Also provided are atomic layer deposition apparatuses and methods including a gas distribution plate with a plurality of gas injector units.Type: ApplicationFiled: March 1, 2011Publication date: September 6, 2012Applicant: Applied Materials, Inc.Inventors: Joseph Yudovsky, Garry K. Kwong, Mei Chang, Anh N. Nguyen, David Thompson
-
Publication number: 20120225192Abstract: Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising at least one gas injector unit. Each gas injector unit comprises a plurality of elongate gas injectors including at least two first reactive gas injectors and at least one second reactive gas injector, the at least two first reactive gas injectors surrounding the at least one second reactive gas injector. Also provided are atomic layer deposition apparatuses and methods including a gas distribution plate with a plurality of gas injector units.Type: ApplicationFiled: July 25, 2011Publication date: September 6, 2012Applicant: Applied Materials, Inc.Inventors: Joseph Yudovsky, Garry K. Kwong, Mei Chang, Anh N. Nguyen, David Thompson