Patents by Inventor Anita Kang

Anita Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anode and anode chamber for copper electroplating
    Patent number: 6821407
    Abstract: An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: November 23, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, Timothy Mark Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri, Steven T. Mayer, David Sauer, Anita Kang, Gerald Feldewerth