Patents by Inventor Anjana Shyamsundar

Anjana Shyamsundar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Foil wound magnetic assemblies with thermally conductive tape and methods of assembling same
    Patent number: 11605496
    Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: March 14, 2023
    Assignee: ABB SCHWEIZ AG
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • Printed circuit boards for power supplies
    Patent number: 11277900
    Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 15, 2022
    Assignee: ABB Power Electronics Inc.
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES
    Publication number: 20210274636
    Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.
    Type: Application
    Filed: November 3, 2020
    Publication date: September 2, 2021
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • Printed circuit boards for power supplies
    Patent number: 10827602
    Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 3, 2020
    Assignee: ABB Power Electronics Inc.
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • FOIL WOUND MAGNETIC ASSEMBLIES WITH THERMALLY CONDUCTIVE TAPE AND METHODS OF ASSEMBLING SAME
    Publication number: 20190311840
    Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.
    Type: Application
    Filed: April 9, 2018
    Publication date: October 10, 2019
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar