Patents by Inventor Ann Chiuchin Lin

Ann Chiuchin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged integrated circuit
    Patent number: 7880265
    Abstract: A packaged integrated circuit includes an integrated circuit and a package substrate. A trace in the package substrate includes a first portion and a second, high-inductance, portion. The high-inductance portion of the trace is proximate to a port of the integrated circuit and provides a selected inductance operating in cooperation with the capacitance of the port to reduce return loss from the port. The first portion of the trace is part of a transmission line having a characteristic impedance.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: February 1, 2011
    Assignee: Xilinx, Inc.
    Inventors: Soon-Shin Chee, Ann Chiuchin Lin
  • Integrated circuit package with improved return loss
    Patent number: 7294904
    Abstract: A packaged integrated circuit includes an integrated circuit and a package substrate. A trace in the package substrate includes a first portion and a second, high-inductance, portion. The high-inductance portion of the trace is proximate to a port of the integrated circuit and provides a selected inductance operating in cooperation with the capacitance of the port to reduce return loss from the port.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: November 13, 2007
    Assignee: Xilinx, Inc.
    Inventors: Soon-Shin Chee, Ann Chiuchin Lin