Patents by Inventor Ann Chu
Ann Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11752582Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.Type: GrantFiled: February 15, 2022Date of Patent: September 12, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Chen Chen, Chih-Hung Huang, Cheng-Lung Wu, Yang-Ann Chu, Jiun-Rong Pai
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Patent number: 11735455Abstract: A system comprises a front opening universal pod (FOUP) configured to hold one or more semiconductor wafers and a load dock having a stage and a receiving portion extending above the stage. The FOUP is positioned on the stage. A fan filter unit (FFU) positioned above the load dock. An air flow optimizer device is disposed on the receiving portion and under the FFU. The air flow optimizer device has an inlet opening and an outlet opening and a channel extends between the inlet opening and the outlet opening.Type: GrantFiled: September 2, 2021Date of Patent: August 22, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Fam Shiu, Cheng-Lung Wu, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
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Publication number: 20230256549Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener form the pod, and the fastener head is received within the lower sleeve.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: Yu-Chen Chen, Chih-Hung Huang, Cheng-Lung Wu, Yang-Ann Chu, Jiun-Rong Pai
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Patent number: 11721572Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.Type: GrantFiled: July 26, 2022Date of Patent: August 8, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
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Patent number: 11705358Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.Type: GrantFiled: September 30, 2019Date of Patent: July 18, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Yi-Fam Shiu, Eason Chen, Yang-Ann Chu, Jiun-Rong Pai
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Patent number: 11699619Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.Type: GrantFiled: April 21, 2021Date of Patent: July 11, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
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Patent number: 11682571Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: GrantFiled: June 24, 2022Date of Patent: June 20, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Kai-Chieh Huang, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee
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Publication number: 20230170234Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.Type: ApplicationFiled: January 30, 2023Publication date: June 1, 2023Inventors: Chih-Hung HUANG, Cheng-Lung WU, Zheng-Lin HE, Yang-Ann CHU, Jiun-Rong PAI, Hsuan LEE
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Patent number: 11651984Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.Type: GrantFiled: April 4, 2022Date of Patent: May 16, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
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Publication number: 20230095609Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.Type: ApplicationFiled: December 2, 2022Publication date: March 30, 2023Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Chih-Hung Huang, Guan-Wei Huang, Jiun-Rong Pai, Hsuan Lee
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Publication number: 20230085172Abstract: A method includes: providing a workpiece to a semiconductor apparatus, the workpiece including a material layer, wherein the material layer includes a first strip having a first plurality of exposure fields configured to be exposed in a first direction and a second plurality of exposure fields configured to be exposed in a second direction different from the first direction; scanning the first strip along a first scan route in the first direction to generate first topography measurement data; scanning the first strip along a second scan route in the second direction to generate second topography measurement data; and exposing the first plurality of exposure fields according to the first topography measurement data and exposing the second plurality of exposure fields according to the second topography measurement data.Type: ApplicationFiled: October 31, 2022Publication date: March 16, 2023Inventors: YUNG-YAO LEE, YEH-CHIN WANG, YANG-ANN CHU, YUNG-HSIANG CHEN, YUNG-CHENG CHEN
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Publication number: 20230063707Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.Type: ApplicationFiled: November 9, 2022Publication date: March 2, 2023Inventors: Tsung-Sheng Kuo, Cheng-Lung Wu, Chih-Hung Huang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
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Publication number: 20230064612Abstract: In some implementations, a reeling device may receive material via a receiving end of a set of guiding blocks positioned around a reel. The set of guiding blocks are configured with an opening at the receiving end and with one or more inner surfaces configured to guide the material on a path around a surface of the reel. The one or more inner surfaces of the set of guiding blocks are arc-shaped to generally follow the surface of the reel. The reeling device may operate a motor that rotates the reel in a loading direction to facilitate loading the material onto the reel. The set of guiding blocks travel generally away from the surface of the reel based on the material being received and/or the motor operating in the loading direction.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yang-Ann CHU, Jiun-Rong PAI
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Publication number: 20230035556Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.Type: ApplicationFiled: July 29, 2021Publication date: February 2, 2023Inventors: Chih-Kuo CHANG, Cheng-Lung WU, Ting-Yau SHIU, Wei-Chen LEE, Yang-Ann CHU, Jiun-Rong PAI
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Patent number: 11569105Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.Type: GrantFiled: June 15, 2020Date of Patent: January 31, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Zheng-Lin He, Yang-Ann Chu, Jiun-Rong Pai, Hsuan Lee
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Publication number: 20230016251Abstract: A compound fork device includes a first prong and a second prong spaced apart from the first prong. Each of the first and second prongs has an upper surface and a lower surface which is depressed relative to the upper surface. The upper surfaces of the first and second prongs are configured to cooperatively retain a first type container. The lower surfaces of the first and second prongs are configured to cooperatively retain a second type container having a configuration different from that of the first type container. A method and a system using the compound fork device are also disclosed.Type: ApplicationFiled: January 13, 2022Publication date: January 19, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Lung WU, Chih-Hung HUANG, Yang-Ann CHU, Jiun-Rong PAI
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Publication number: 20230012325Abstract: A wafer magazine is disposed on a load port of an oven chamber. The wafer magazine contains one or more wafer boats with semiconductor wafers. The wafer boats are supported in the wafer magazine by wall slots of the wafer magazine. Using a push bar, the wafer boats are transferred out of the wafer magazine and into a wafer magazine jig also disposed on the load port. The transferred one or more wafer boats are supported in the wafer magazine jig by wall slots of the wafer magazine jig. During transfer, the wafer boats are supported across a gap between the wafer magazine and the wafer magazine jig by wall slots of a boat bridge interposed between the wafer magazine and the wafer magazine jig. After the transfer and using a robot, the wafer boats in the wafer magazine jig are moved into the oven chamber.Type: ApplicationFiled: January 24, 2022Publication date: January 12, 2023Inventors: Cheng-Lung Wu, Chih-Hung Huang, Yang-Ann Chu, Jiun-Rong Pai
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Publication number: 20220399219Abstract: A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieve from the cassette residing in the storage buffer; and determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position.Type: ApplicationFiled: March 15, 2022Publication date: December 15, 2022Inventors: Cheng-Lung WU, Chih-Hung Huang, Yang-Ann Chu, Jiun-Rong Pai
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Patent number: 11527425Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.Type: GrantFiled: December 31, 2019Date of Patent: December 13, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Chih-Hung Huang, Guan-Wei Huang, Jiun-Rong Pai, Hsuan Lee
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Patent number: 11508596Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.Type: GrantFiled: May 28, 2020Date of Patent: November 22, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Cheng-Lung Wu, Chih-Hung Huang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai