Patents by Inventor Ann Issaris

Ann Issaris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Water-permeable adhesive tape
    Patent number: 7608328
    Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: October 27, 2009
    Assignees: Nitto Denko Corporation, Nitto Europe N.V.
    Inventors: Walter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada
  • Water-permeable adhesive tape
    Publication number: 20070110955
    Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
    Type: Application
    Filed: January 8, 2007
    Publication date: May 17, 2007
    Inventors: Walter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada
  • Water-permeable adhesive tape
    Publication number: 20010055928
    Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
    Type: Application
    Filed: March 28, 2001
    Publication date: December 27, 2001
    Inventors: Walter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada