Patents by Inventor Ann Mattos

Ann Mattos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer-level package with silicon gasket
    Patent number: 6979597
    Abstract: A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: December 27, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Frank S Geefay, Qing Gan, Ann Mattos, Domingo A Figueredo
  • Wafer-level package with silicon gasket
    Patent number: 6787897
    Abstract: A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: September 7, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Frank S Geefay, Qing Gan, Ann Mattos, Domingo A Figueredo
  • Wafer-level package with silicon gasket
    Publication number: 20040029360
    Abstract: A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.
    Type: Application
    Filed: July 8, 2003
    Publication date: February 12, 2004
    Inventors: Frank S. Geefay, Qing Gan, Ann Mattos, Domingo A. Figueredo
  • Wafer-level package with silicon gasket
    Publication number: 20030116825
    Abstract: A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventors: Frank S. Geefay, Qing Gan, Ann Mattos, Domingo A. Figueredo