Patents by Inventor Anna George, legal representative

Anna George, legal representative has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thinned die integrated circuit package
    Patent number: 7888183
    Abstract: A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: February 15, 2011
    Assignee: Intel Corporation
    Inventors: Cheng-Yi Liu, Johanna Swan, Steven Towle, Anna George, legal representative, Chuan Hu
  • Thinned die integrated circuit package
    Patent number: 7420273
    Abstract: A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: September 2, 2008
    Assignee: Intel Corporation
    Inventors: Cheng-Yi Liu, Johanna Swan, Anna George, legal representative, Chuan Hu, Steven Towle
  • On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
    Patent number: 7236666
    Abstract: Optical apparatus, methods of forming the apparatus, and methods of using the apparatus are disclosed herein. In one aspect, an optical apparatus may include a substrate, an on-substrate microlens coupled with the substrate to receive light from an off-substrate light emitter and focus the light toward a focal point, and an on-substrate optical device coupled with the substrate proximate the focal point to receive the focused light. Communication of light in the reverse direction is also disclosed. Systems including the optical apparatus are also disclosed.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: June 26, 2007
    Assignee: Intel Corporation
    Inventors: Anna George, legal representative, Henning Braunisch, Daoqiang Lu, Gilroy J. Vandentop, Steven Towle, deceased
  • Waveguide coupling mechanism
    Patent number: 7085449
    Abstract: A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: August 1, 2006
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Anna George, legal representative, Daoqiang Lu, Gilroy Vandentop, Steven Towle, deceased