Patents by Inventor Anna Seyfarth

Anna Seyfarth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Valve seat ring
    Patent number: 11311936
    Abstract: The invention relates to a highly heat conductive valve seat ring (1) comprising a carrier layer (2) and a functional layer (3), wherein the carrier layer (2) consists of a solidified copper matrix containing 0.10 to 20% w/w of a solidifying component and the functional layer (3) consists of a solidified copper matrix which further contains, based on the copper matrix, 5 to 35% w/w of one or more hard phases.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: April 26, 2022
    Assignee: Bleistahl-Produktions GmbH & Co KG
    Inventors: Ekkehard Kohler, Dirk Emde, Ingwar Hunsche, Robert Hammelmann, Christian Blecking, Anna Seyfarth
  • VALVE SEAT RING
    Publication number: 20190143415
    Abstract: The invention relates to a highly heat conductive valve seat ring (1) comprising a carrier layer (2) and a functional layer (3), wherein the carrier layer (2) consists of a solidified copper matrix containing 0.10 to 20% w/w of a solidifying component s and the functional layer (3) consists of a solidified copper matrix which further contains, based on the copper matrix, 5 to 35% w/w of one or more hard phases.
    Type: Application
    Filed: May 24, 2017
    Publication date: May 16, 2019
    Applicant: Bleistahl-Produktions GmbH &Co KG
    Inventors: Ekkehard Kohler, Dirk Emde, Ingwar Hunsche, Robert Hammelmann, Christian Blecking, Anna Seyfarth
  • Highly thermally conductive valve seat ring
    Patent number: 10208636
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: February 19, 2019
    Assignee: Bleistahl-Produktions GmbH & Co, KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann
  • HIGHLY THERMALLY CONDUCTIVE VALVE SEAT RING
    Publication number: 20170298790
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Application
    Filed: June 21, 2017
    Publication date: October 19, 2017
    Applicant: Bleistahl-Produktions GmbH & Co. KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann
  • Highly thermally conductive valve seat ring
    Patent number: 9702277
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: July 11, 2017
    Assignee: Bleistahl-Produktions GmbH & Co. KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgermann
  • HIGHLY THERMALLY CONDUCTIVE VALVE SEAT RING
    Publication number: 20150322828
    Abstract: The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 12, 2015
    Applicant: Bleistahl-Produktions GmbH & Co. KG
    Inventors: Ekkehard Kohler, Dirk Emde, Anna Seyfarth, Thomas Lelgemann