Patents by Inventor Annayya P. Deshpande
Annayya P. Deshpande has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8111480Abstract: An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.Type: GrantFiled: April 21, 2008Date of Patent: February 7, 2012Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
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Patent number: 7492552Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.Type: GrantFiled: August 4, 2007Date of Patent: February 17, 2009Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
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Patent number: 7446974Abstract: An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.Type: GrantFiled: January 14, 2005Date of Patent: November 4, 2008Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
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Publication number: 20080218904Abstract: An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.Type: ApplicationFiled: April 21, 2008Publication date: September 11, 2008Inventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
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Patent number: 7274536Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.Type: GrantFiled: June 7, 2006Date of Patent: September 25, 2007Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
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Patent number: 7161764Abstract: A magnetic head according to another embodiment includes a head body including a top face, a bottom face, a pair of elongated side faces, and a pair of short end faces; at least one transducer formed in communication with the top face of the head body; and a single groove formed in the top face of the head body and extending between the transducers and one of the side faces of the head body. A method for manufacturing a magnetic head is also presented.Type: GrantFiled: August 23, 2001Date of Patent: January 9, 2007Assignee: International Business Machines CorporationInventors: Robert G. Biskeborn, Annayya P. Deshpande, Calvin S. Lo, Kevin T. Luong, Abel J. Taina, Artemio-Juan Torres
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Patent number: 7082013Abstract: A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.Type: GrantFiled: May 6, 2003Date of Patent: July 25, 2006Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
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Patent number: 6863061Abstract: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.Type: GrantFiled: January 15, 2003Date of Patent: March 8, 2005Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
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Publication number: 20040223261Abstract: A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.Type: ApplicationFiled: May 6, 2003Publication date: November 11, 2004Inventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
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Publication number: 20040134477Abstract: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.Type: ApplicationFiled: January 15, 2003Publication date: July 15, 2004Applicant: INTERNATIONAL BUSINESS MACHINESInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
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Publication number: 20030039070Abstract: A plurality of apparatuses and methods are provided for improving the manufacture and operational characteristics of thin magnetic film heads. First provided is an apparatus and method for bonding a beam and a magnetic head with optimal precision. Also included is a saw apparatus capable of dicing magnetic heads on an associated wafer in a manner that affords a planar operating surface on the magnetic head. Still yet, a specific head structure is provided which has single a groove that affords all of the benefits of the prior art head structures, but with only one action required during the thin-film head manufacturing process.Type: ApplicationFiled: August 23, 2001Publication date: February 27, 2003Inventors: Robert G. Biskeborn, Annayya P. Deshpande, Calvin S. Lo, Kevin T. Luong, Abel J. Taina, Artemio-Juan Torres
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Patent number: 6468376Abstract: A precision clamping apparatus is described which is suitable for use with a high temperature curing process. A clamp according to the invention includes a base plate with a supporting surface for a component (which consists of two portions to be bonded together), and at least two alignment stops against which the first and second sides of the component can be pressed. A pressure plate is provided to mate with the base plate to exert uniform clamping force on the component to allow a uniform thickness of cured adhesive to form between internal surfaces of the component. The pressure plate is precisely aligned with the supporting surface in the horizontal plane by guides which allow vertical movement. The pressure plate is made self-aligning with the surface of the component by being urged toward the supporting surface by a resilient structure which is in turn held in position by attachment to the base plate. Adjustable lateral fingers are provided to urge the component against the alignment stops.Type: GrantFiled: January 3, 2001Date of Patent: October 22, 2002Assignee: International Business Machines CorporationInventors: Robert Glenn Biskeborn, Annayya P. Deshpande, Calvin Shyhjong Lo, Artemio Juan Torres
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Publication number: 20020084040Abstract: A precision clamping apparatus is described which is suitable for use with a high temperature curing process. A clamp according to the invention includes a base plate with a supporting surface for a component (which consists of two portions to be bonded together), and at least two alignment stops against which the first and second sides of the component can be pressed. A pressure plate is provided to mate with the base plate to exert uniform clamping force on the component to allow a uniform thickness of cured adhesive to form between internal surfaces of the component. The pressure plate is precisely aligned with the supporting surface in the horizontal plane by guides which allow vertical movement. The pressure plate is made self-aligning with the surface of the component by being urged toward the supporting surface by a resilient structure which is in turn held in position by attachment to the base plate. Adjustable lateral fingers are provided to urge the component against the alignment stops.Type: ApplicationFiled: January 3, 2001Publication date: July 4, 2002Inventors: Robert Glenn Biskeborn, Annayya P. Deshpande, Clavin Shyhjong Lo, Artemio Juan Torres
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Patent number: 5531017Abstract: A novel thin film magnetic head fabrication process is provided for fabricating a plurality of thin film magnetic head elements. The process begins with the selection of an appropriate wafer substrate of suitable size and quality. At least two primary sub-areas of the wafer substrate are designated as work areas for the deposition of magnetic recording transducer elements. The work areas have first and second end portions and are arranged in mutually adjacent relation along a shared boundary zone that extends in a first direction through the wafer substrate between the first and second end portions. The wafer substrate is populated with plural rows of magnetic recording transducer elements in the designated work areas such that the plural rows extend in a second direction that is substantially perpendicular to the first direction. The work areas are separated from the wafer substrate and magnetic transducer slider elements are fabricated from the plural rows of magnetic recording transducer elements.Type: GrantFiled: December 27, 1995Date of Patent: July 2, 1996Assignee: International Business Machines CorporationInventors: Mark A. Church, Annayya P. Deshpande, Alain M. Desouches
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Patent number: 5266769Abstract: A method for making a magnetic head slider comprising the steps of lapping the slider to form an air bearing surface, producing a chosen pattern of rails on the air bearing surface, and producing a chosen pattern of stress on the back side of the slider to remove the distortion produced in the slider by the lapping and rail formation steps. The stress pattern can be chosen to produce any desired range of crown and camber for the slider.Type: GrantFiled: February 25, 1992Date of Patent: November 30, 1993Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Randall T. Kerth, Henri M. Nier
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Patent number: 4914868Abstract: A lapping control system for a row of thin film magnetic transducers formed on a substrate. Each of the magnetic transducers comprises a magnetoresistive (MR) element, and the row is supported on a holder which has an elongated H-shaped slot near one edge to form a beam member upon which the row is mounted. The beam member is capable of being deflected in a substantially quadratic curvature when subjected to pressure from a pressure transducer at the middle of the beam member. The resistance of each of the MR elements is measured during lapping, and a control signal is generated to control the pressure transducers to control lapping with proper BALANCE and BOW and to terminate lapping when the desired MR element height is reached.Type: GrantFiled: September 28, 1988Date of Patent: April 10, 1990Assignee: International Business Machines CorporationInventors: Mark A. Church, Annayya P. Deshpande, Alain M. Desouches, George S. Pal, Michael P. Salo, Muhammad I. Ullah